Datasheet > LQB18NNR47J10#

LQB18NNR47J10#

更新时间： 2023-09-03 20:28:10

品牌	Logo	应用领域
村田 - MURATA		/
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9页	229K
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数据手册

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LQB18NNR47J10# 数据手册

Spec. No. JELF243B-0034C-01

P.7/9

(3) soldering profile

• Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C, 60s min.

265°C ±3°C, 5s max.

2 times

250°C, 4s～6s

Cycle of flow

2 times

• Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C, 90s ± 30s

Heating

above 220°C, 30s～60s above 230°C, 60s max.

Peak temperature

Cycle of reflow

245°C ± 3°C

2 times

260°C, 10s

2 times

10-3. Reworking with soldering iron

• Pre-heating: 150°C, 1 min

• Soldering iron output: 80W max.

• Tip diameter: φ3mm max.

• Times : 2times max.

• Tip temperature: 350°C max.

• Soldering time : 3(+1, -0) seconds.

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the

ferrite material due to the thermal shock.

10-4. Solder Volume

Solder shall be used not to be exceeded as shown below.

Upper Limit

Recommendable

1/3T≦t≦T

(T: Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

MURATA MFG.CO., LTD.

1...4 5 678 9

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