Spec. No. JELF243B-0034C-01
P.6/9
9. ! Caution
9-1. Limitation of Applications
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
• Standard land dimensions
Chip Coil
Soldering
Flow
Reflow
a
b
c
c
2.2 to 2.6
1.8 to 2.0
0.7
0.7
a
b
Solder Resist
Pattern
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Flux
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
Solder
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is
limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
MURATA MFG.CO., LTD.