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LPC1114LVFHN24/103 PDF预览

LPC1114LVFHN24/103

更新时间: 2024-02-28 00:36:42
品牌 Logo 应用领域
恩智浦 - NXP 静态存储器
页数 文件大小 规格书
53页 1354K
描述
32-bit ARM Cortex-M0 MCU; up to 32 kB flash, 8 kB SRAM; 8-bit ADC

LPC1114LVFHN24/103 数据手册

 浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第1页浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第3页浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第4页浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第5页浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第6页浏览型号LPC1114LVFHN24/103的Datasheet PDF文件第7页 
LPC111xLV/LPC11xxLVUK  
NXP Semiconductors  
32-bit ARM Cortex-M0 microcontroller  
UART with fractional baud rate generation and internal FIFO.  
One SPI controller with SSP features and with FIFO and multi-protocol capabilities.  
I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a  
data rate of 1 Mbit/s with multiple address recognition and monitor mode.  
Clock generation:  
12 MHz internal RC oscillator trimmed to 2.5 % accuracy for Tamb = -20 °C to  
+85 °C and to 5 % accuracy for Tamb = -40 °C to -20 °C. The IRC can optionally be  
used as a system clock.  
Crystal oscillator with an operating range of 1 MHz to 25 MHz.  
Programmable watchdog oscillator with a frequency range of 9.4 kHz to 2.3 MHz.  
PLL allows CPU operation up to the maximum CPU rate without the need for a  
high-frequency crystal. May be run from the system oscillator or the internal RC  
oscillator.  
Clock output function with divider that can reflect the system oscillator clock, IRC  
clock, CPU clock, and the Watchdog clock.  
Power control:  
Two reduced power modes: Sleep and Deep-sleep mode.  
Ultra-low power consumption in Deep-sleep mode (1.6 A).  
5 s wake-up time from Deep-sleep mode.  
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to  
13 of the functional pins.  
Power-On Reset (POR).  
Brown-Out Detection (BOD) causing a forced reset.  
Unique device serial number for identification.  
Single power supply (1.65 V to 1.95 V)  
Available as WLCSP25, HVQFN24, and HVQFN33 package. Other package options  
are available for high-volume customers.  
3. Applications  
Mobile phones  
Tablets/Ultra books  
Active cables  
Mobile accessories  
Cameras  
Portable medical electronics  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
LPC1101LVUK  
WLCSP25  
WLCSP25  
HVQFN24  
wafer level chip-size package; 25 bumps; 2.17 2.32 0.56 mm  
wafer level chip-size package; 25 bumps; 2.17 2.32 0.56 mm  
-
LPC1102LVUK  
-
LPC1112LVFHN24/003  
plastic thermal enhanced very thin quad flat package; no leads; 24  
terminals; body 4 x 4 x 0.85 mm  
SOT616-3  
LPC1114LVFHN24/103  
HVQFN24  
plastic thermal enhanced very thin quad flat package; no leads; 24  
terminals; body 4 x 4 x 0.85 mm  
SOT616-3  
LPC111XLV_LPC11XXLVUK  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 10 October 2012  
2 of 53  

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