是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | FBGA, BGA16,4X4,20 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.06 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-PBGA-B16 | JESD-609代码: | e1 |
长度: | 1.996 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA16,4X4,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8 V | 认证状态: | Not Qualified |
子类别: | Other Analog ICs | 最大供电电流 (Isup): | 3.3 mA |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 1.996 mm | Base Number Matches: | 1 |
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