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SLVS521B − JULY 2004 − REVISED OCTOBER 2004
DBV (SOT-23) PACKAGE
(TOP VIEW)
D
Available in the Texas Instruments
NanoStar Chip Scale Package
D
Fixed/ADJ Versions
V
GND
ON/OFF
V
OUT
1
2
3
5
4
IN
D
Output Tolerance of:
− 0.75% (A Grade)
− 1.25% (Standard Grade)
†
ADJ/NC
D
Ultra-Low Dropout, Typically
− 200 mV at Full Load of 100 mA
− 7 mV at 1 mA
YEQ, YEU, YZQ, OR YZU (WCSP) PACKAGE
(TOP VIEW)
D
D
Wide V Range . . . 16 V Max
IN
GND
1 5
ON/OFF
†
Low I . . . 600 µA Typ at Full Load of
2
ADJ/NC
Q
100 mA
V
V
3 4
OUT
IN
D
D
D
D
D
Shutdown Current . . . 0.01 µA Typ
Fast Transient Response to Line and Load
Overcurrent and Thermal Protection
High Peak Current Capability
†
Must be left open in fixed-output versions
Portable Applications
− Mobile Phones
− Laptops
− Personal Digital Assistants (PDAs)
− Digital Cameras and Camcorders
− CD and MP3 Players
description/ordering information
The LP2981 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for
both portable and nonportable applications. Available in adjustable version and in fixed voltages of 1.8 V,
2.5 V, 2.7 V, 2.8 V, 2.9 V, 3 V, 3.2 V, 3.3 V, 3.6 V, and 5 V, the family has an output tolerance of 0.75% for the
A-grade devices (1.25% for the standard grade) and is capable of delivering 100-mA continuous load current.
Standard regulator features, such as over-current and over-temperature protection, are included.
The LP2981 has features that make the regulator an ideal candidate for a variety of portable applications:
• Low dropout: A PNP pass element allows a typical dropout of 200 mV at 100-mA load current and 7 mV
at 1-mA load.
• Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are
considerably lower than those associated with traditional lateral PNP regulators.
• Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 µA when the
ON/OFF pin is pulled low.
• Small packaging: For the most space-constraint needs, the regulator is available in SOT-23 package
and NanoStar chip scale packaging. NanoStar package technology is a major breakthrough in IC
packaging concepts, using the die as the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar is a trademark of Texas Instruments.
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Copyright 2004, Texas Instruments Incorporated
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