OBSOLETE
LOC211P
INTEGRATED
CIRCUITS
DIVISION
Mechanical Dimensions
LOC211P
10.160 0.381
(0.400 0.015)
PCB Land Pattern
0.254 0.0127
(0.010 0.0005)
PIN 16
10.363 0.127
(0.408 0.005)
9.30
(0.366)
0.635 X 45°
(0.025 X 45°)
7.493 0.127
(0.295 0.005)
1.016 TYP
(0.040 TYP)
1.90
(0.075)
PIN 1
1.27
(0.050)
1.270 TYP
(0.050 TYP)
2.057 0.051
(0.081 0.002)
0.60
(0.024)
DIMENSIONS
mm
(inches)
0.406 TYP
(0.016 TYP)
8.890 TYP
(0.350 TYP)
0.508 0.1016
(0.020 0.004)
Lead to Package Standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
NOTES:
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
LOC211PTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16
(0.630)
B0=10.70
(0.421)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
A0=10.90
(0.429)
P1=12.00
(0.472)
(0.126)
Direction of feed
K1=2.70
(0.106)
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
Dimensions
mm
Embossment
(inches)
For additional information please visit our website at: https://www.ixysic.com
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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
Specification: DS-LOC211P-ROBS
©Copyright 2023, Littelfuse, Inc.
All rights reserved. Printed in USA.
5
4/26/2023