是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | MSOP-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.34 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 411367 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | LMV358DMR2G |
Samacsys Released Date: | 2019-04-18 14:03:34 | Is Samacsys: | N |
放大器类型: | OPERATIONAL AMPLIFIER | 架构: | VOLTAGE-FEEDBACK |
标称共模抑制比: | 65 dB | 频率补偿: | YES |
最大输入失调电压: | 9000 µV | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 3 mm |
低-偏置: | NO | 低-失调: | NO |
微功率: | YES | 湿度敏感等级: | 1 |
功能数量: | 2 | 端子数量: | 8 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法: | TAPE AND REEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 功率: | NO |
电源: | 2.7/5 V | 可编程功率: | NO |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
标称压摆率: | 1 V/us | 子类别: | Operational Amplifier |
最大压摆率: | 0.615 mA | 供电电压上限: | 5.5 V |
标称供电电压 (Vsup): | 2.7 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 标称均一增益带宽: | 1000 kHz |
最小电压增益: | 10000 | 宽带: | NO |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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