是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | VFBGA, | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.33.00.01 |
风险等级: | 5.2 | Is Samacsys: | N |
标称带宽: | 22 kHz | 商用集成电路类型: | AUDIO AMPLIFIER |
谐波失真: | 0.18% | JESD-30 代码: | S-XBGA-B4 |
JESD-609代码: | e1 | 长度: | 1.179 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 4 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.35 mm | 最大供电电压 (Vsup): | 5 V |
最小供电电压 (Vsup): | 2 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.179 mm | Base Number Matches: | 1 |
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