LM4889
www.ti.com
SNAS157H –APRIL 2002–REVISED MAY 2013
Absolute Maximum Ratings(1)(2)
Supply Voltage
6.0V
Storage Temperature
−65°C to +150°C
Input Voltage
−0.3V to VDD +0.3V
Power Dissipation(3)
Internally Limited
ESD Susceptibility(4)
ESD Susceptibility(5)
Junction Temperature
2000V
200V
150°C
Thermal Resistance
θJC (SOIC)
35°C/W
θJA (SOIC)
150°C/W
θJA (8 Bump DSBGA)(6)
θJC (VSSOP)
θJA (VSSOP)
θJA (WSON)
210°C/W
56°C/W
190°C/W
220°C/W
Soldering Information
See the AN-1112 Application Report.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4889, see power derating currents for additional information.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
(6) All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board
(views featured in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure
600mils x 600mils (15.24mm x 15.24mm) and aid in spreading heat due to power dissipation within the IC.
Operating Ratings
Temperature Range TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 85°C
2.2V ≤ VDD ≤ 5.5V
Supply Voltage
Electrical Characteristics VDD = 5V(1)(2)
The following specifications apply for VDD = 5V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4889
Limit(4)(5)
Units
(Limits)
Symbol
Parameter
Conditions
Typical(3)
VIN = 0V, Io = 0A, no Load
VIN = 0V, Io = 0A, with BTL Load
Vshutdown = GND(6)
4
5
8
8
mA (max)
mA (max)
µA (max)
V (min)
V (max)
W
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
0.1
2
VSDIH
VSDIL
Po
Shutdown Voltage Input High
Shutdown Voltage Input Low
Output Power
1.2
0.4
THD = 2% (max); f = 1 kHz
Po = 0.4 Wrms; f = 1kHz
1
THD+N
Total Harmonic Distortion+Noise
0.1
%
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test or statistical analysis.
(6) For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
Copyright © 2002–2013, Texas Instruments Incorporated
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