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LM4863MX PDF预览

LM4863MX

更新时间： 2024-11-18 04:18:31
品牌 Logo 应用领域
美国国家半导体 - NSC /
页数 文件大小 规格书
2页 25K
描述
Engineering Project Manager

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中文翻译

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LM4863MX 数据手册

 浏览型号LM4863MX的Datasheet PDF文件第2页 
Company  
URL for Additional Information  
National Semiconductor  
http://www.national.com/quality/green/  
Contact  
Title  
Phone  
Email  
Engineering Project Manager  
Green.project@nsc.com  
Gloria Gordon  
1-408-721-8435  
Part Number  
MSL Rating  
Peak Body Temp C  
MaxTime (Sec)  
Cycles  
LM4863MX  
2A  
220  
30  
4
Document Date  
Weight (mg)  
Unit Type  
This part number contains Lead(Pb) and is NOT RoHS Compliant.  
3-Dec-2006  
420.000  
Each  
Homogeneous Material Composition Declaration for Electronic Products  
Item  
Weight (mg)  
Component  
CAS#  
Weight (mg)  
211.278  
ppm  
692,600  
Plastic  
305.050 SiO2  
60676-86-0  
25928-94-3  
1309-64-4  
Epoxy Resin  
Sb2O3  
85.414  
6.101  
2.257  
99.311  
2.446  
0.122  
0.031  
5.398  
0.953  
5.318  
0.032  
0.000  
0.000  
0.000  
0.000  
0.000  
0.428  
0.143  
0.470  
0.300  
280,000  
20,000  
7,400  
Brominated Epoxy  
40039-93-8  
7440-50-8  
7439-89-6  
7440-66-6  
7723-14-0  
7440-31-5  
7439-92-1  
7440-21-3  
7429-90-5  
7440-38-2  
7440-42-8  
7440-56-4  
7723-14-0  
7440-36-0  
7440-22-4  
25928-94-3  
7440-22-4  
7440-57-5  
Leadframe  
101.910 Cu  
974,500  
24,000  
1,200  
Fe  
Zn  
P
300  
Ext. LeadFinish  
Chip  
6.350 Sn  
Pb  
850,000  
150,000  
994,000  
6,000  
5.350 Si  
Al  
As (dopant)  
<1  
B (dopant)  
Ge (dopant)  
P (dopant)  
Sb (dopant)  
<1  
<1  
<1  
<1  
Die Attach  
0.570 Ag  
Epoxy Resin  
0.470 Ag  
0.300 Au  
750,000  
250,000  
1,000,000  
1,000,000  
Int. LeadFinish  
Wires  
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical  
testing. Additionally, the following should be noted:  
1. One or more dopant materials may be present in the silicon die to provide semiconductor properties.The amounts are very small and estimated  
as listed.  
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.  
3. Brominated epoxy resins listed are generic and may or may not be the specific chemical used. The identity of the compound used is  
proprietary, however National certifies that these brominated compounds are not PBB or PBDE's, which are banned.  
4. The die attach, if present, does not contain any flame retardant.  
National Semiconductor  
Page 1 of 2  
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