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LM3679TLX-1.8

更新时间： 2024-11-15 03:15:39
品牌 Logo 应用领域
美国国家半导体 - NSC 转换器
页数 文件大小 规格书
16页 3778K
描述
3MHz, 350mA Miniature Step-Down DC-DC Converter for Ultra Low Profile Applications (Height < 0.55mm)

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LM3679TLX-1.8 数据手册

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February 5, 2008  
LM3679  
3MHz, 350mA Miniature Step-Down DC-DC Converter for  
Ultra Low Profile Applications (Height < 0.55mm)  
General Description  
Features  
The LM3679 step-down DC-DC converter is optimized for  
powering ultra-low voltage circuits from a single Li-Ion cell  
battery and input voltage rails from 2.5V to 5.5V. It provides  
up to 350mA load current, over the entire input voltage range.  
The LM3679 output voltage can be configured to 1.2V, 1.5V,  
or 1.8V.  
16 µA typical quiescent current  
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350 mA maximum load capability  
3 MHz PWM fixed switching frequency (typ)  
Automatic PFM/PWM mode switching  
Available in 5-bump micro SMD package and UR package  
Internal synchronous rectification for high efficiency  
The device offers superior features and performance for mo-  
bile phones and similar portable applications with complex  
power management systems. Automatic intelligent switching  
between PWM low-noise and PFM low-current mode offers  
improved system control. During PWM mode operation, the  
device operates at a fixed-frequency of 3 MHz (typ). PWM  
mode drives loads from ~ 80mA to 350mA max. Hysteretic  
PFM mode extends the battery life by reducing the quiescent  
current to 16 µA (typ) during light load and standby operation.  
Internal synchronous rectification provides high efficiency. In  
shutdown mode (Enable pin pulled low), the device turns off  
and reduces battery consumption to 0.01 µA (typ).  
Internal soft start  
0.01 µA typical shutdown current  
Operates from a single Li-Ion cell battery  
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Current overload and Thermal shutdown protection  
Three external components required for typical  
applications  
Low profile solution (0.55mm max height, includes four  
external components)  
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Applications  
The LM3679 is available in a lead-free (No PB) 5-bump micro  
SMD package, 0.6mm height, and in an ultra thin 0.3mm  
height UR package. Using the UR package along with specific  
external components, allows for a low profile solution size with  
a max height of 0.55mm. A switching frequency of 3 MHz (typ)  
allows use of tiny surface-mount components. Only three ex-  
ternal surface-mount components, an inductor and two ce-  
ramic capacitors, are required. .  
Mobile phones  
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PDAs  
MP3 players  
W-LAN  
Portable Instruments  
Digital still cameras  
Portable Hard disk drives  
Efficiency vs. Output Current  
(VOUT = 1.8V)  
Typical Application Circuit  
30016301  
FIGURE 1. Typical Low Profile Application Circuit  
(0.55mm max height using LM3679UR)  
30016387  
© 2008 National Semiconductor Corporation  
300163  
www.national.com  
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