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LM3209TLX-G3-NOPB

更新时间： 2024-11-24 12:46:31
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德州仪器 - TI 转换器电池放大器射频功率放大器升压转换器
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22页 1440K
描述
Seamless-Transition Buck-Boost Converter for Battery-Powered 3G/4G RF Power Amplifiers

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LM3209TLX-G3-NOPB 数据手册

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LM3209-G3  
www.ti.com  
SNVS626B –NOVEMBER 2009–REVISED MARCH 2013  
LM3209-G3 Seamless-Transition Buck-Boost Converter for Battery-Powered 3G/4G RF  
Power Amplifiers  
Check for Samples: LM3209-G3  
1
FEATURES  
APPLICATIONS  
2
•
Operates From a Single Li-Ion Cell: 2.7V to  
5.5V  
•
•
•
•
Battery-Powered 3G/4G RF PAs  
Cellular Phones  
•
•
Adjustable Output Voltage: 0.6V to 4.2V  
Portable Hard Disk Drives  
PDAs  
1A Maximum Load Capability for VIN ≥ 3.2V,  
VOUT = 3.6V  
•
•
•
2.4 MHz (typ.) Switching Frequency  
DESCRIPTION  
The LM3209-G3 is buck-boost DC/DC converter  
designed to generate output voltages above or below  
a given input voltage. It is particularly suitable for  
single-cell Li-ion batteries for portable applications.  
Seamless Buck-Boost Mode Transition  
Fast Output Voltage Transition: 0.8V to 4.0V in  
20 µs  
•
High-Efficiency: 95% typ. at 3.7 VIN, 3.5 VOUT, at  
300 mA  
The LM3209-G3 operates at a 2.4 MHz typical  
switching frequency in full synchronous operation  
providing seamless transitions between buck and  
boost operating modes.  
•
•
•
•
Cycle-by-cycle Over-Current Limit  
Output Over-Voltage Clamp  
Internal Compensation  
The power converter topology needs only one  
external inductor and two capacitors. Five internal  
power switches enable high overall efficiency.  
12-bump DSBGA Package  
The LM3209-G3 is internally compensated for buck  
and boost modes of operation, thus providing an  
optimal transient response.  
The LM3209-G3 is available in an 12-bump lead-free  
DSBGA package of size 2.0 mm x 2.5 mm x 0.6 mm.  
TYPICAL APPLICATION CIRCUIT  
2.2 mH  
SW1  
PVIN  
SW2  
V
: 2.7V to 5.5V  
IN  
V : 0.6V to 4.2V  
OUT  
VOUT  
FB  
PVIN  
RF PA  
LM3209-G3  
VCON  
EN  
4.7 mF  
10 mF  
SGND  
PGND  
DAC  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2013, Texas Instruments Incorporated  
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