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LM3200

更新时间： 2024-02-12 16:58:52
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
23页 981K
描述
Miniature, Adjustable, Step-Down DC-DC Converter

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LM3200 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：VFBGA, BGA10,3X4,20
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.74
其他特性：ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8 TO 3.6V模拟集成电路 - 其他类型：SWITCHING REGULATOR
控制模式：CURRENT-MODE控制技术：PULSE WIDTH MODULATION
最大输入电压：5.5 V最小输入电压：2.7 V
标称输入电压：3.6 VJESD-30 代码：R-PBGA-B10
JESD-609代码：e1长度：2.1955 mm
湿度敏感等级：1功能数量：1
端子数量：10最高工作温度：85 °C
最低工作温度：-25 °C最大输出电流：0.94 A
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA10,3X4,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度（摄氏度）：260
认证状态：Not Qualified座面最大高度：0.675 mm
子类别：Other Analog ICs表面贴装：YES
切换器配置：BUCK最大切换频率：2000 kHz
技术：CMOS温度等级：OTHER
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.8315 mm
Base Number Matches：1

LM3200 数据手册

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LM3200  
www.ti.com  
SNVS319C –NOVEMBER 2004–REVISED APRIL 2013  
LM3200 Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF  
Power Amplifiers  
Check for Samples: LM3200  
1
FEATURES  
DESCRIPTION  
The LM3200 is a DC-DC converter optimized for  
powering RF power amplifiers (PAs) from a single  
Lithium-Ion cell. It steps down an input voltage of  
2.7V to 5.5V to a variable output voltage of 0.8V to  
3.6V. The output voltage is set using an analog input  
( VCON) for optimizing efficiency of the RF PA at  
various power levels.  
2
•
2 MHz (typ.) PWM Switching Frequency  
•
Operates from a Single Li-Ion Cell (2.7V to  
5.5V)  
•
•
Variable Output Voltage (0.8V to 3.6V)  
300 mA Maximum Load Capability (PWM  
Mode)  
The LM3200 offers superior features and  
performance for mobile phones and similar RF PA  
applications. Fixed-frequency PWM mode minimizes  
RF interference. Bypass mode turns on an internal  
bypass switch to power the PA directly from the  
battery. LM3200 has both forced and automatic  
bypass modes. Shutdown mode turns the device off  
and reduces battery consumption to 0.1 µA (typ.).  
The LM3200 is available in a 10-pin lead free DSBGA  
package. A high switching frequency (2 MHz) allows  
use of tiny surface-mount components. Only three  
small external surface-mount components, an  
inductor and two ceramic capacitors are required.  
•
500 mA Maximum Load Capability (Bypass  
Mode)  
•
•
PWM, Forced and Automatic Bypass Mode  
High Efficiency (96% Typ at 3.6VIN, 3.2VOUT at  
120 mA) from Internal Synchronous  
Rectification  
•
•
•
10-pin DSBGA Package  
Current Overload Protection  
Thermal Overload Protection  
APPLICATIONS  
•
•
•
•
Cellular Phones  
Hand-Held Radios  
RF PC Cards  
Battery Powered RF Devices  
TYPICAL APPLICATION  
V
IN  
2.7V to 5.5V  
BYPOUT  
V
PV  
IN  
DD  
L
V
OUT  
2.2 mH  
C
0.8V to 3.6V  
IN  
EN  
BYP  
SW  
FB  
10 mF  
V
OUT  
= 3 x V  
CON  
LM3200  
V
CON  
C
OUT  
PGND SGND  
V
CON  
4.7 mF  
0.267V to 1.20V  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
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