Datasheet > LM2903H

LM2903H

更新时间： 2024-04-09 19:01:21

品牌	Logo	应用领域
润石 - RUNIC		比较器
页数	文件大小	规格书
19页	686K
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高速比较器

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LM2903H 数据手册

LM2903H

7 SPECIFICATIONS

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

MIN

MAX

UNIT

Supply, V_S=(V+) - (V-)

-0.3

(V-)-0.3

-10

(V+) +0.3

Voltage

Current

Input pin (IN+, IN-) ⁽²⁾

Signal output pin ⁽³⁾

Signal input pin (IN+, IN-) ⁽²⁾

Signal output pin ⁽³⁾

-20

Output short-circuits ⁽⁴⁾

Continuous

SOIC-8(SOP8)

MSOP-8

110.88

165.7

125

Package thermal impedance ⁽⁵⁾

°C/W

°C

θ_JA

Operating range, T_A

-40

-65

(6)

Temperature

Junction, T_J

150

Storage, T_stg

150

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should

be current-limited to 10mA or less.

(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.3V beyond the supply rails

should be current-limited to ±20mA or less.

(4) Short-circuit from output to V_CCcan cause excessive heating and eventual destruction.

(5) The package thermal impedance is calculated in accordance with JESD-51.

(6) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient

temperature is P_D= (T _J(MAX)- T_A) / R_θJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings

The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

VALUE UNIT

Human-Body Model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾

Charged Device Model (CDM), per JEDEC specification JESD22-C101⁽²⁾

±2000

±1 000

Electrostatic

discharge

V_(ESD)

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single-supply

Dual-supply

3.8

Supply voltage，V_S= (V+) - (V-）

±1.9

±18

6 / 19

www.run-ic.com

1...3 4 567 8 9...19

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