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LM2619_03

更新时间: 2024-09-16 04:44:39
品牌 Logo 应用领域
美国国家半导体 - NSC 转换器
页数 文件大小 规格书
15页 856K
描述
500mA Sub-Miniature Step-Down DC-DC Converter

LM2619_03 数据手册

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October 2003  
LM2619  
500mA Sub-Miniature Step-Down DC-DC Converter  
General Description  
Key Specifications  
n Operates from a single LiION cell (2.8V to 5.5V)  
n Output voltage (1.5V to 3.6V)  
The LM2619 step down DC-DC converter is optimized for  
powering circuits from a single Lithium-Ion cell. It steps down  
an input voltage of 2.8V to 5.5V to an output of 1.5V to 3.6V  
at up to 500mA. Output voltage is set using resistor feedback  
dividers.  
n
1% DC feedback voltage precision  
n 500mA maximum load capability  
n 600µA typ PWM mode quiescent current  
n 0.02µA typ shutdown current  
n 600kHz PWM switching frequency  
n SYNC input for PWM mode frequency synchronization  
from 500kHz to 1MHz  
n High efficiency (96% typ at 3.9VIN, 3.6VOUT and 200mA)  
in PWM mode from internal synchronous rectification  
n 100% Maximum Duty Cycle for Lowest Dropout  
The device offers three modes for mobile phones and similar  
portable applications. Fixed-frequency PWM mode mini-  
mizes RF interference. A SYNC input allows synchronizing  
the switching frequency in a range of 500kHz to 1MHz. Low  
current hysteretic PFM mode reduces quiescent current to  
160µA (typ.). Shutdown mode turns the device off and re-  
duces battery consumption to 0.02µA (typ.).  
Current limit and thermal shutdown features protect the de-  
vice and system during fault conditions.  
Features  
The LM2619 is available in a 10 bump micro SMD package.  
This packaging uses National’s chip-scale micro SMD tech-  
nology and offers the smallest possible size. A high switching  
frequency (600kHz) allows use of tiny surface-mount com-  
ponents.  
n Sub-miniature 10-bump thin micro SMD package  
n Uses small ceramic capacitors  
n 5mV typ PWM mode output voltage ripple(COUT = 22µF)  
n Internal soft start  
The device features external compensation to tailor the re-  
sponse to a wide range of operating conditions.  
n Current overload protection  
n Thermal Shutdown  
n External compensation  
Applications  
n Mobile Phones  
n Hand-Held Radios  
n RF PC Cards  
n Wireless LAN Cards  
© 2003 National Semiconductor Corporation  
DS200574  
www.national.com  

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