Datasheet > LM25184-Q1

LM25184-Q1

更新时间： 2023-09-03 20:28:17

品牌	Logo	应用领域
德州仪器 - TI		光电转换器
页数	文件大小	规格书
40页	2658K
描述
具有 65V、4.1A 集成式 MOSFET 的汽车类 42V 输入电压非光电反激式转换器

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LM25184-Q1 数据手册

LM25184-Q1

ZHCSKZ5A – MARCH 2020 – REVISED AUGUST 2020

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)⁽¹⁾

MIN

–0.3

–1.5

–3

MAX

UNIT

VIN to GND

EN/UVLO to GND

TC to GND

Input voltage

SS/BIAS to GND

FB to GND

45.3

0.3

FB to VIN

RSET to GND

SW to GND

Output voltage

SW to GND (20-ns transient)

Operating junction temperature, T_J

Storage temperature, T_stg

–40

–55

150

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per AEC Q100-002

HBM ESD Classification Level 2 ⁽¹⁾

±2000

V_(ESD)

Electrostatic discharge

All pins except 1, 4,

5, and 8

Charged device model (CDM), per

AEC Q100-011

CDM ESD Classification Level C4B

±500

±750

Pins 1, 4, 5, and 8

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)

MIN

NOM

MAX

UNIT

V_IN

Input voltage

4.5

V_SW

SW voltage

V_EN/UVLO

V_SS/BIAS

T_J

EN/UVLO voltage

SS/BIAS voltage

Operating junction temperature

–40

150

°C

6.4 Thermal Information

LM25184-Q1

THERMAL METRIC⁽¹⁾

NGU (WSON)

8 PINS

40.9

UNIT

R_ΘJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_ΘJC(top)

R_ΘJB

36.9

17.7

Ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.4

Ψ_JB

17.7

R_ΘJC(bot)

2.7

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

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