LL4001G THRU LL4007G
SURFACE MOUNT GLASS PASSIVATED SILICON RECTIFIERS
Reverse Voltage - 50 to 1000 V
Forward Current - 1 A
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• For surface mounted applications
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
Mechanical data
• Case: Molded plastic, MELF (DO-213AB)
• Terminals: Solder plated, solderable per
MIL-STD-750, method 208 guaranteed
Plastic case MELF (DO-213AB)
Dimensions in inches and (millimeters)
• Polarity: Color band denotes cathode end
• Mounting position: Any
Maximum Ratings and Electrical characteristics
Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive
load, derate current by 20%.
LL4001G LL4002G LL4003G LL4004G LL4005G LL4006G LL4007G
Parameter
Symbols
VRRM
VRMS
Units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
50
35
50
100
70
200
140
200
400
280
400
1
600
420
600
800
560
800
1000
700
V
V
V
A
Maximum DC Blocking Voltage
VDC
100
1000
Maximum Average Forward Rectified Current at TA = 75 OC
IF(AV)
Peak Forward Surge Current 8.3 ms Single Half Sine Wave
Superimposed on Rated Load (JEDEC Method)
IFSM
VF
IR
30
A
V
Maximum Forward Voltage at 1 A
1.1
Maximum Reverse Current
at Rated DC Blocking Voltage
TA = 25 OC
5
200
µA
TA = 125 OC
Typical Junction Capacitance 1)
Typical Thermal Resistance 2)
Typical Thermal Resistance 3)
Operating Junction Temperature Range
Storage Temperature Range
CJ
RθJA
RθJT
Tj
15
50
pF
OC/W
OC/W
OC
20
- 55 to + 150
- 55 to + 150
Tstg
OC
1) Measured at 1 MHz and applied reverse voltage of 4 V D.C
2) Thermal resistance from junction to ambient, 0.24 X 0.24" (6 X 6 mm) copper pads to each terminal
3) Thermal resistance from junction to terminal, 0.24 X 0.24" (6 X 6 mm) copper pads to each terminal
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
Dated : 23/12/2008
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