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LH5324C00 PDF预览

LH5324C00

更新时间: 2024-11-16 22:15:47
品牌 Logo 应用领域
夏普 - SHARP /
页数 文件大小 规格书
6页 56K
描述
CMOS 24M (1.5M x 16) MROM

LH5324C00 数据手册

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LH5324C00  
CMOS 24M (1.5M × 16) MROM  
FEATURES  
PIN CONNECTIONS  
1,572,864 × 16 bit organization  
42-PIN DIP  
TOP VIEW  
Access time: 120 ns (MAX.)  
A18  
A17  
A7  
1
2
3
42 A19  
41 A8  
40 A9  
Supply current:  
– Operating: 80 mA (MAX.)  
– Standby: 100 µA (MAX.)  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
4
5
39 A10  
38 A11  
37 A12  
36 A13  
35 A14  
34 A15  
TTL compatible I/O  
Three-state output  
Single +5 V Power supply  
Static operation  
6
7
8
9
10  
33  
A16  
CE 11  
32 A20  
31 GND  
30 D15  
29 D7  
GND 12  
When the address input at both A19 and  
A20 is high level, outputs become high  
impedance irrespective of CE or OE.  
OE  
D0  
D8  
13  
14  
15  
28 D14  
27 D6  
D1 16  
Package:  
D9  
D2  
17  
18  
26 D13  
25 D5  
24 D12  
23 D4  
22 VCC  
42-pin, 600-mil DIP  
Others:  
D10 19  
D3  
20  
21  
– Non programmable  
– Not designed or rated as radiation  
hardened  
D11  
5324C00-1  
– CMOS process (P type silicon  
substrate)  
Figure 1. Pin Connections  
DESCRIPTION  
The LH5324C00 is a 24M-bit mask-programmable  
ROM organized as 1,572,864 × 16 bits. It is fabricated  
using silicon-gate CMOS process technology.  
1

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