Datasheet
9. Package Dim ensions
Millim eters
Sym bol
Min
4.360
0.000
0.700
0.510
1.200
1.170
0.380
0.380
1.190
8.600
6.900
10.150
8.100
Nom
Max
4.560
0.250
0.900
0.890
1.460
1.370
0.694
0.534
1.340
9.000
7.500
10.550
8.700
A
A1
b
-
-
-
b1
b2
b3
c
-
-
-
-
c1
c2
D
-
-
-
D1
E
-
-
E1
e
-
2.540 BSC
H
15.000
-
15.600
2.500
1.650
1.780
L
1.900
-
L1
L2
L3
L4
J1
-
-
-
(Section G-G & TT)
Notes:
-
Recom m ended Solder Pad Layout:
0.250
1. Dimensioning & tolerancing confirm to
ASME Y14.5M-1994.
4.780
2.560
-
-
5.280
2.960
2. All dimensions are in millimeters. Angles
are in degrees.
3. Heatsink side flash is max 0.8 mm.
4. Radius on terminal is optional
10. Part Num bering and Marking
11. Packing Options
Packing
Mode
GB8245
= Device Code
= Assembly Location
= Lot Number
= Year
Part Num ber
Package
M.O.Q.
A
D2PAK
(Pb-Free)
LGB8245TI
Tape & Reel
800
XX
Y
WW
= Work Week
For additional inform ation please visit w w w .Littelfuse.com / pow ersem i
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saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of
the product may result in personal injury, death, or property damage) other than those expressly forth in applicable Littelfuse product documentation. Littelfuse shall not be liable for
any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation.
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8
Specifications are subject to change without notice.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2020 Littelfuse, Inc.
Revised: 3/30/2020