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LG226C333MAT2X1 PDF预览

LG226C333MAT2X1

更新时间: 2024-11-30 20:53:35
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX 电容器
页数 文件大小 规格书
2页 143K
描述
Ceramic Capacitor, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.033uF, Surface Mount, 0306, CHIP

LG226C333MAT2X1 技术参数

生命周期:Active包装说明:, 0306
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.23.00.20风险等级:5.54
电容:0.033 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMICJESD-609代码:e3
安装特点:SURFACE MOUNT多层:No
负容差:20%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, 7 INCH
正容差:20%额定(直流)电压(URdc):6.3 V
尺寸代码:0306表面贴装:YES
温度特性代码:X7R温度系数:15% ppm/ °C
端子面层:TIN端子形状:WRAPAROUND
Base Number Matches:1

LG226C333MAT2X1 数据手册

 浏览型号LG226C333MAT2X1的Datasheet PDF文件第2页 
LGA Low Inductance Capacitors  
0204/0306/0805 Land Grid Arrays  
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.  
These new LGA products are the third low inductance family developed by AVX. The in-  
novative LGA technology sets a new standard for low inductance MLCC performance.  
Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling  
capacitor.  
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal  
IDC low inductance MLCC with a number of advantages including:  
Simplified layout of 2 large solder pads compared to 8 small pads for IDCs  
Opportunity to reduce PCB or substrate contribution to system ESL by using multi-  
ple parallel vias in solder pads  
Advanced FCT manufacturing process used to create uniformly flat terminations on  
the capacitor that resist “tombstoning”  
Better solder joint reliability  
APPLICATIONS  
Semiconductor Packages  
Microprocessors/CPUs  
Graphics Processors/GPUs  
Chipsets  
FPGAs  
ASICs  
Board Level Device Decoupling  
Frequencies of 300 MHz or more  
ICs drawing 15W or more  
Low voltages  
High speed buses  
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC  
1
0.1  
0.01  
0.001  
1
10  
100  
1000  
Frequency (MHz)  
68  

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