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LF80539KF0412M PDF预览

LF80539KF0412M

更新时间： 2024-11-23 12:03:27
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
4页 359K
描述
Dual-Core Intel® Xeon® Processors LV and ULV for Embedded Computing

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中文翻译

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LF80539KF0412M 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：PGA包装说明：PGA, PGA478,26X26,50
针数：478Reach Compliance Code：compliant
ECCN代码：3A001.A.3HTS代码：8542.31.00.01
风险等级：5.83地址总线宽度：
位大小：64边界扫描：YES
最大时钟频率：100 MHz外部数据总线宽度：
格式：FLOATING POINT集成缓存：YES
JESD-30 代码：S-PBGA-P478长度：35 mm
低功率模式：YES端子数量：478
封装主体材料：PLASTIC/EPOXY封装代码：PGA
封装等效代码：PGA478,26X26,50封装形状：SQUARE
封装形式：GRID ARRAY电源：1.1,1.5 V
认证状态：Not Qualified座面最大高度：2.273 mm
速度：2000 MHz子类别：Microprocessors
最大压摆率：36000 mA表面贴装：NO
技术：CMOS端子形式：PIN/PEG
端子节距：1.27 mm端子位置：BOTTOM
宽度：35 mmuPs/uCs/外围集成电路类型：MICROPROCESSOR
Base Number Matches：1

LF80539KF0412M 数据手册

 浏览型号LF80539KF0412M的Datasheet PDF文件第2页浏览型号LF80539KF0412M的Datasheet PDF文件第3页浏览型号LF80539KF0412M的Datasheet PDF文件第4页 
Product Brief  
Dual-Core Intel® Xeon® Processors LV and ULV  
Embedded Computing  
Dual-Core Intel® Xeon® Processors LV  
and ULV for Embedded Computing  
Product Overview  
Dual-Core Intel® Xeon® processors LV and ULV are members of  
Intel’s growing product line of multi-core processors, utilizing Intel’s  
65nm process technology to integrate two cores, along with many  
advanced features, into one physical package. With a thermal de-  
sign power (TDP) of 31W (LV) and 15W (ULV), these processors  
combine the benefits of two high-performance execution cores  
with intelligent power management features to deliver signifi-  
cantly greater performance-per-watt over previous single-core  
Intel® Xeon® processors.  
Available in three speeds – 2.16 GHz (LV), 2.0 GHz (LV) and 1.66  
GHz (LV and ULV) – these dual-core processors are ideal for a  
wide range of low-power embedded, storage and communications  
Product Highlights  
applications such as storage area networks (SAN), network  
attached storage (NAS), routers, virtual private networks (VPN),  
ruggedized small form factor systems, intrusion detection systems,  
and telecommunications (wireless and wireline) servers, particularly  
in AdvancedTCA* form-factor designs. While incorporating advanced  
processor technology, they remain software-compatible with  
previous IA-32 processors.  
Intel’s comprehensive processor/chipset validation process enables  
fast deployment of next-generation platforms to help developers  
maximize competitive advantage while minimizing development  
risks. Dual-Core Intel Xeon processors LV and ULV are validated  
with the following:  
Thermal Control  
APIC  
Thermal Control  
APIC  
Thermal Control  
APIC  
Thermal Control  
APIC  
Power Management Logic  
Power Management Logic  
Shared L2 Cache  
Bus Interface  
Shared L2 Cache  
Bus Interface  
667 MHz Front-Side Bus  
Figure 1: Dual-processor configuration for Dual-Core Intel® Xeon® processors LV and ULV,  
supported by the Intel® E7520 chipset, provides four high-performance cores per platform.  
1234

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