Datasheet > LDBAB2680GC5N0

LDBAB2680GC5N0

更新时间： 2022-02-26 10:48:08

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
12页	842K
描述
LDB Series Unencapsulated Stacked Chip, Size 1206 â 1812, 16 and 50 VDC

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数据手册

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LDBAB2680GC5N0 数据手册

Surface Mount Metallized PPS Film Capacitors

LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC

Soldering Process

Reﬂow Recommendations

Preheating

Maximum Preheating Time

Minimum Temperature

Maximum Temperature

180 seconds

150°C

200°C

30 seconds (T_maxꢀ≤ꢀ250°C)

10 seconds (250 °C < T_maxꢀ≤ꢀ260°C)

Maximum Time within T_maxand

T_maxꢀ–ꢀ5°Cꢀ(∆T₅)

Maximum Time Over 217°C

(∆T₂₁₇

150 seconds

)

3°C/seconds (heating)

6°C/seconds (cooling)

Maximum Temperature Ramp Rate

Secondꢀreﬂow

Ifꢀtwoꢀreﬂowꢀprocessesꢀareꢀneeded,ꢀbeꢀsureꢀthatꢀbeforeꢀtheꢀsecondꢀreﬂow,ꢀ

the temperature on the capacitor’s surface is lower than 50°C.

* For LDB series this value is 260 °C.

Maximum Temperature on Component Body (T_max)

Capacitor Volume (mm³)

Capacitor

H_max(mm)

< 1.6

< 350

255°C *

250°C

350 – 2,000

> 2,000

255°C *

245°C

255°C *

250°C

245°C

1.6 – 2.5

> 2.5

245°C

*In line with JEDEC STD 020D ed. June 2007 with some limitations.

* For LDB series this value is 260 °C.

Flux/Cleaning/Storage and Moisture

Flux suggestions

Weꢀsuggestꢀtoꢀuseꢀaꢀno-cleanꢀﬂuxꢀwithꢀaꢀhalogenꢀcontentꢀlowerꢀthanꢀ0.1%.

Cleaning suggestions

To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol, deionized water or neutral pH detergents.

Solvents like Toluene, Xylene and Trichloroethylene should not be used.

F3082_LDB • 5/20/2015

1...4 5 678 9 10...12

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