生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | DIP, | 针数: | 30 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.84 | 具有ADC: | YES |
其他特性: | ALSO AVAILABLE IN MFP30S PACKAGE | 地址总线宽度: | |
位大小: | 4 | 最大时钟频率: | 4.33 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDIP-T30 | |
I/O 线路数量: | 22 | 端子数量: | 30 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 认证状态: | Not Qualified |
ROM可编程性: | MROM | 速度: | 4.33 MHz |
最大供电电压: | 6 V | 最小供电电压: | 4 V |
标称供电电压: | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | THROUGH-HOLE | 端子位置: | DUAL |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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