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L7833S PDF预览

L7833S

更新时间: 2024-11-20 21:53:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 266K
描述
HEXFETPower MOSFET

L7833S 数据手册

 浏览型号L7833S的Datasheet PDF文件第2页浏览型号L7833S的Datasheet PDF文件第3页浏览型号L7833S的Datasheet PDF文件第4页浏览型号L7833S的Datasheet PDF文件第5页浏览型号L7833S的Datasheet PDF文件第6页浏览型号L7833S的Datasheet PDF文件第7页 
PD - 94668B  
IRL7833  
IRL7833S  
IRL7833L  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Consumer Use  
VDSS RDS(on) max  
Qg  
32nC  
3.8m  
30V  
Benefits  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
D2Pak  
IRL7833S  
TO-262  
IRL7833L  
TO-220AB  
IRL7833  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-to-Source Voltage  
30  
V
V
Gate-to-Source Voltage  
± 20  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
150  
110  
600  
I
I
I
@ TC = 25°C  
@ TC = 100°C  
D
D
A
DM  
Maximum Power Dissipation  
Maximum Power Dissipation  
P
P
@TC = 25°C  
@TC = 100°C  
140  
72  
W
D
D
Linear Derating Factor  
Operating Junction and  
0.96  
W/°C  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Mounting Torque, 6-32 or M3 screw  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
Max.  
1.04  
–––  
62  
Units  
Rθ  
Rθ  
Rθ  
Rθ  
Junction-to-Case  
–––  
0.50  
–––  
–––  
JC  
CS  
JA  
JA  
Case-to-Sink, Flat, Greased Surface  
°C/W  
Junction-to-Ambient  
Junction-to-Ambient (PCB Mount)  
40  
Notes  through † are on page 12  
www.irf.com  
1
4/22/04  

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