L37-3F
Thermal Conductive Pad
Version 1.180418
Thermal Conductive Pad
L37-3F is an ultra thin silicone based thermal interface pad which offers a good
combination of high dielectric breakdown voltage, compliance and low thermal
impedance. It contains a fibreglass mesh for enhanced ease of manufacture and is
available in various formats such as standard sheets, log-rolls and custom die cut
parts. L37-3F is available in a range of thicknesses and with one or two side thermally
conductive adhesive pre-applied.
Features
Made of silicone, thermal conductive particles, fibreglass
Low elongation
Electrical insulation
Easy to assemble
Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Properties
REACH Compliant
ROHS Compliant
Property
L37-3F
Yellow
Unit
-
Tolerance
Test Method
Visual
Colour
-
-
Thickness
(Available thickness
range)
0.25/0.3/0.45
mm
ASTM D374
0.0098/0.0118/0.0177
inch
-
ASTM D374
Thermal Conductivity
Flammability Rating
1.4
W/mK
-
0.14
-
ASTM D5470
UL 94
V-0
Dielectric Breakdown
Voltage
4
kV/mm
0.4
ASTM D149
Weight Loss
Density
‹1
%
-
ASTM E595
ASTM D792
-
2
-40 to 200
›10¹³
5
g/cm³
˚C
0.2
-
Working Temperature
Volume Resistance
Elongation
Ohm-cm
%
-
ASTM D257
ASTM D412
ASTM D412
ASTM D2240
13
2
Tensile Strength
Hardness
150
Kgf/cm²
Shore A
90
3
Thermal Impedance vs Pressure vs Deflection
T-Global Technology Limited
1 & 2 Cosford Business Park, Central Park,
Lutterworth, Leicestershire LE17 4QU U.K.
Tel: +44 (0)1455 553 510
Email: sales@tglobaltechnology.com
Web: www.tglobaltechnology.com
Skype: tglobal.technology
VAT #: GB 116 662 714