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L1GL30F663KA02 PDF预览

L1GL30F663KA02

更新时间: 2024-11-10 14:49:19
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
12页 1527K
描述
KPS-MCC Indust C0G HT200C, Ceramic, 0.066 uF, 10%, 1500 VDC, C0G

L1GL30F663KA02 数据手册

 浏览型号L1GL30F663KA02的Datasheet PDF文件第2页浏览型号L1GL30F663KA02的Datasheet PDF文件第3页浏览型号L1GL30F663KA02的Datasheet PDF文件第4页浏览型号L1GL30F663KA02的Datasheet PDF文件第5页浏览型号L1GL30F663KA02的Datasheet PDF文件第6页浏览型号L1GL30F663KA02的Datasheet PDF文件第7页 
Surface Mount and Through-Hole Multilayer Ceramic Capacitors  
KPS-MCC High Temperature 200°C SMPS Stacks  
50 – 2,000 VDC (Industrial Grade)  
Overview  
KEMET Power Solutions - Military Case Code (KPS-MCC)  
High Temperature SMPS Ceramic Stacked Capacitors  
combine a robust and proprietary C0G/NPO base metal  
electrode (BME) dielectric system with a durable lead-  
frame technology for high temperature and high power  
SMPSꢀapplications.ꢀTheseꢀdevicesꢀareꢀspecificallyꢀ  
designed to withstand the demands of harsh industrial  
environments such as down-hole oil exploration and  
automotive/avionics engine compartment circuitry.  
and thermal stress performance, while the parallel circuit  
configurationꢀallowsꢀforꢀbulkꢀcapacitanceꢀinꢀtheꢀsameꢀorꢀ  
smaller design footprint.  
KEMET’s high temperature C0G capacitors are temperature-  
compensating and are well suited for resonant circuit  
applications, or for those where Q and stability of  
capacitance characteristics are required. They exhibit no  
change in capacitance with respect to time and voltage, and  
boast a negligible change in capacitance with reference to  
ambient temperature. Capacitance change is limited to ±30  
ppm/ºCꢀfromꢀ−55°Cꢀtoꢀ+200°C.ꢀInꢀaddition,ꢀtheseꢀcapacitorsꢀ  
exhibit high insulation resistance with low dissipation factor  
atꢀelevatedꢀtemperaturesꢀupꢀtoꢀ+200°C.ꢀTheyꢀalsoꢀexhibitꢀ  
low ESR at high frequencies and offer greater volumetric  
efficiencyꢀoverꢀcompetitiveꢀhighꢀtemperatureꢀBMEꢀceramicꢀ  
capacitor devices.  
The KPS-MCC is constructed with large chip multilayer  
ceramic capacitors (MLCCs), horizontally stacked and  
secured to a lead-frame termination system, using a high  
melting point (HMP) solder alloy. The lead-frame isolates  
the MLCCs from the printed circuit board (PCB), while  
establishingꢀaꢀparallelꢀcircuitꢀconfiguration.ꢀMechanicallyꢀ  
isolating the capacitors from the PCB improves mechanical  
Benefits  
• Straight Pin lead wires for "through-hole" mounting  
• Formed "J" and "L" lead wires for surface mounting  
•ꢀ Operatingꢀtemperatureꢀrangeꢀofꢀ−55°ꢀtoꢀ+200°Cꢀ  
• Military-style case codes (MCC) 3, 4, and 5  
• DC voltage ratings of 50 – 2,000 V  
• Capacitance offerings ranging from 4.7 nF – 2.0 µF  
• Industrial grade  
• High frequency performance and bulk capacitance in a  
reduced footprint  
• Low ESR and ESL  
• High thermal stability  
• High ripple current capability  
Built Into Tomorrow  
© KEMET Electronics Corporation • One East Broward Boulevard  
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com  
C1094_KPS-MCC_200C_STACKS • 8/22/2023  
1

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