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KMPC8250ACVRIHBB PDF预览

KMPC8250ACVRIHBB

更新时间: 2024-02-05 03:07:34
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 外围集成电路
页数 文件大小 规格书
68页 722K
描述
32-BIT, 200MHz, RISC PROCESSOR, PBGA516, PLASTIC, BGA-516

KMPC8250ACVRIHBB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:BGA, BGA516,26X26,40Reach Compliance Code:unknown
风险等级:5.89位大小:32
JESD-30 代码:S-PBGA-B516JESD-609代码:e0
端子数量:516最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA516,26X26,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.7/2.1,3.3 V认证状态:Not Qualified
速度:300 MHz子类别:Microprocessors
表面贴装:YES温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC

KMPC8250ACVRIHBB 数据手册

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Advance Information  
MPC8250EC/D  
Rev.0.8 11/2002  
MPC8250  
Hardware Specications  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “Power Considerations”  
Section 1.2.4, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
5
5
10  
10  
11  
17  
17  
21  
27  
53  
56  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an  
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,  
“Package Description.” For more information on VR packages, contact your Motorola sales  
office. Note that throughout this document references to the MPC8250 are inclusive of its VR  
version unless otherwise specified.  
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE  

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