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KMPC8250ACVRIHBC PDF预览

KMPC8250ACVRIHBC

更新时间: 2024-01-25 09:39:01
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 外围集成电路
页数 文件大小 规格书
73页 885K
描述
RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA516, 27 X 27 MM, PLASTIC, BGA-516

KMPC8250ACVRIHBC 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA, BGA516,26X26,40针数:516
Reach Compliance Code:unknown风险等级:5.55
地址总线宽度:32位大小:32
边界扫描:YES外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-PBGA-B516长度:27 mm
端子数量:516最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA516,26X26,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.7/2.1,3.3 V认证状态:Not Qualified
座面最大高度:2.55 mm速度:200 MHz
子类别:Microprocessors最大供电电压:1.9 V
最小供电电压:1.7 V标称供电电压:1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
宽度:27 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC

KMPC8250ACVRIHBC 数据手册

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Technical Data  
MPC8250EC/D  
Rev.0.9 8/2003  
MPC8250  
Hardware Specications  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “Power Considerations”  
Section 1.2.4, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
5
5
10  
10  
11  
19  
19  
22  
28  
53  
56  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an  
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,  
“Package Description.” For more information on VR packages, contact your Motorola sales  
office. Note that throughout this document references to the MPC8250 are inclusive of its VR  
version unless otherwise specified.  
NOTE: Document Revision History  
Changes to this document are summarized in Table 23 on  
page 56.  

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