生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.84 |
最长访问时间: | 55 ns | JESD-30 代码: | R-PBGA-B48 |
长度: | 12 mm | 内存密度: | 8388608 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.75 mm | 端子位置: | BOTTOM |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KM68FV8100FI-700 | SAMSUNG |
获取价格 |
Standard SRAM, 1MX8, 70ns, CMOS, PBGA48, 8 X 12 MM, 0.75 MM PITCH, FBGA-48 | |
KM68FV8100RI-7 | SAMSUNG |
获取价格 |
Standard SRAM, 1MX8, 70ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 | |
KM68FV8100TI-5 | SAMSUNG |
获取价格 |
Standard SRAM, 1MX8, 55ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
KM68LC302AF20VCT | NXP |
获取价格 |
4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, | |
KM68LC302PU20VCT | NXP |
获取价格 |
4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, | |
KM68LC302PU20VCT | MOTOROLA |
获取价格 |
LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, 0.50 M | |
KM68S1000ELTGI-10L | SAMSUNG |
获取价格 |
Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP-32 | |
KM68S1000ELTGI-8L | SAMSUNG |
获取价格 |
Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP-32 | |
KM68S1000ELTI-10L | SAMSUNG |
获取价格 |
Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
KM68S1000ELTI-8L | SAMSUNG |
获取价格 |
Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 |