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KM681002CTI-2000 PDF预览

KM681002CTI-2000

更新时间: 2024-11-26 14:34:11
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 199K
描述
Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32

KM681002CTI-2000 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2,针数:32
Reach Compliance Code:unknownECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.83
最长访问时间:20 nsJESD-30 代码:R-PDSO-G32
长度:20.95 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128KX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

KM681002CTI-2000 数据手册

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PRELIMINARY  
KM681002C/CL, KM681002CI/CLI  
CMOS SRAM  
Document Title  
128Kx8 Bit High-Speed CMOS Static RAM(5V Operating).  
Operated at Commercial and Industrial Temperature Ranges.  
Revision History  
Rev.No.  
Rev. 0.0  
Rev. 1.0  
History  
Remark  
Preliminary  
Final  
Draft Data  
Aug. 5. 1998  
Mar. 3. 1999  
Initial release with Preliminary.  
Release to Final Data Sheet.  
1.1. Delete Preliminary.  
2.2. Added Data Retention Characteristics.  
Rev. 2.0  
Add 10ns part.  
Final  
Mar. 3. 2000  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Revision 2.0  
March 2000  
- 1 -  

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