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KM44C1000DT-L5 PDF预览

KM44C1000DT-L5

更新时间: 2024-11-25 14:51:51
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
21页 372K
描述
Fast Page DRAM, 1MX4, 50ns, CMOS, PDSO20, 0.300 INCH, TSOP2-26/20

KM44C1000DT-L5 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSOP2, TSOP20/26,.36
针数:20Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.56访问模式:FAST PAGE
最长访问时间:50 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-G20
JESD-609代码:e0长度:17.14 mm
内存密度:4194304 bit内存集成电路类型:FAST PAGE DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:20
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP20/26,.36
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified刷新周期:1024
座面最大高度:1.2 mm自我刷新:NO
最大待机电流:0.0002 A子类别:DRAMs
最大压摆率:0.085 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

KM44C1000DT-L5 数据手册

 浏览型号KM44C1000DT-L5的Datasheet PDF文件第2页浏览型号KM44C1000DT-L5的Datasheet PDF文件第3页浏览型号KM44C1000DT-L5的Datasheet PDF文件第4页浏览型号KM44C1000DT-L5的Datasheet PDF文件第5页浏览型号KM44C1000DT-L5的Datasheet PDF文件第6页浏览型号KM44C1000DT-L5的Datasheet PDF文件第7页 
KM44C1000D, KM44V1000D  
CMOS DRAM  
1M x 4Bit CMOS Dynamic RAM with Fast Page Mode  
DESCRIPTION  
This is a family of 1,048,576 x 4bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory cells  
within the same row. Power supply voltage (+5V or +3.3V), access time (-5, -6 or -7), power consumption(Normal or Low power), and  
package type (SOJ or TSOP-II) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and  
Hidden refresh capabilities. Furthermore, self-refresh operation is available in 3.3V Low power version.  
This 1Mx4 Fast Page Mode DRAM family is fabricated using Samsung¢s advanced CMOS process to realize high band-width, low power  
consumption and high reliability. It may be used as main memory for main frames and mini computers, personal computer and high per-  
formance microprocessor systems.  
Fast Page Mode operation  
FEATURES  
CAS-before-RAS refresh capability  
• Part Identification  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (3.3V, L-ver only)  
• Fast parallel test mode capability  
- KM44C1000D/D-L(5V, 1K Ref.)  
- KM44V1000D/D-L(3.3V, 1K Ref.)  
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs  
Early write or output enable controlled write  
• JEDEC Standard pinout  
Active Power Dissipation  
Unit : mW  
5V  
Available in 26(20)-pin SOJ 300mil and TSOP(II)  
300mil packages  
Speed  
-5  
3.3V  
-
Single +5V±10% power supply(5V product)  
Single +3.3V±0.3V power supply(3.3V product)  
470  
-6  
220  
200  
415  
-7  
360  
FUNCTIONAL BLOCK DIAGRAM  
Refresh Cycles  
RAS  
CAS  
W
Vcc  
Vss  
Part  
NO.  
Refresh  
cycle  
Refresh Period  
Control  
Clocks  
VBB Generator  
Normal  
L-ver  
KM44C1000D  
KM44V1000D  
1K  
16ms  
128ms  
Row Decoder  
Refresh Timer  
Refresh Control  
Data in  
Buffer  
Memory Array  
1,048,576 x4  
Cells  
DQ0  
to  
DQ3  
Performance Range  
Refresh Counter  
Row Address Buffer  
Col. Address Buffer  
Speed  
-5  
Remark  
tRAC  
tCAC  
tRC  
tPC  
50ns 15ns 90ns 35ns 5V only  
60ns 15ns 110n 40ns 5V/3.3V  
70ns 20ns 130n 45ns 5V/3.3V  
Data out  
Buffer  
A0~A9  
-6  
Column Decoder  
OE  
-7  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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