DATA SHEET
SEMICONDUCTOR
KBPC35005 THRU KBPC3510
VOLTAGE RANGE 50 to 1000 Volts
CURRENT 35 Ampere
MB-35 Uniti:nch(mm)
FEATURES
‧ Low cost
‧ This series is UL recognized under component
index, file number E127707
‧ High forward surge current capability
‧ Integrally molded heatsink provide
very low thermal resistance.
‧ High isolation voltage from case to lugs.
‧ High temperature soldering guaranteed:
260℃/10 second, at 5 lbs. (2.3kg) tension.
‧ High temperature soldering : 260OC / 10 seconds at terminals
‧ Pb free product at available : 99% Sn above meet RoHS
environment substance directive request
MECHANICAL DATA
‧ Case: Metal case
‧ Terminal: Plated 0.25" (6.35mm) lug.
‧ Polarity: Polarity symbols marked on case.
‧ Mounting: Thru hole for #10 screw, 20 in,- lbs. Torqute Max.
‧ Weight: 1.02 ounce, 29gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
‧ Ratings at 25℃ ambient temperature unless otherwise specified
‧ Single phase, half wave, 60Hz, resistive or inductive load.
‧ For capacitive load derate current by 20%
KBPC KBPC KBPC KBPC KBPC KBPC
KBPC
3510
PARAMETER
SYMBOLS
UNIT
35005 3501 3502
3504
3506
3508
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
VRRM
VRMS
VDC
50
35
50
100
70
200
140
200
400
600
800
1000
700
Volts
Volts
Volts
280
400
420
600
560
800
Maximum DC Blocking Voltage
100
1000
Maximum Average Forward Rectified Output
Current, at TC = 50℃ (Note 1, 2)
Peak Forward Surge Current
I(AV)
IFSM
35
Amps
Amps
8.3ms single half sine - wave superimposed on
rated load (JEDEC method )
400
Rating for Fusing (t<8.3ms)
I2t
664
1.1
A2s
Maximum Instantaneous Forward Voltage Drop
per bridge element at 17.5A
VF
Volts
TA = 25℃
TA =100℃
10
μA
Maximum DC Reverse Current at rate
DC blocking voltage per element
IR
1.0
mA
Isolation Voltage from case to lugs
Typical Thermal Resistance (Note 1,2)
Operating Temperature Range
Storage Temperature Range
VISO
RθJC
TJ
2500
2.0
VAC
℃/W
(-65 to +150)
(-65 to +150)
℃
TSTG
1. Unit mounted on 9" X 3.5" X 4.6" (23cm X 9cm X 11.8cm)Al. finned Plate.
2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat transfer efficiency with # 10 screw.
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1
REV.02 20120305