5秒后页面跳转
K8P2716UZC-JC4D0 PDF预览

K8P2716UZC-JC4D0

更新时间: 2024-02-14 21:37:35
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路闪存
页数 文件大小 规格书
56页 1463K
描述
Flash, 8MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64

K8P2716UZC-JC4D0 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TBGA, BGA64,8X8,40
针数:64Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最长访问时间:70 ns
备用内存宽度:8命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B64长度:13 mm
内存密度:134217728 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:128端子数量:64
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA64,8X8,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE页面大小:8/16 words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8/3.3,3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:128K
最大待机电流:0.00004 A子类别:Flash Memories
最大压摆率:0.055 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:11 mm
Base Number Matches:1

K8P2716UZC-JC4D0 数据手册

 浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第1页浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第2页浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第4页浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第5页浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第6页浏览型号K8P2716UZC-JC4D0的Datasheet PDF文件第7页 
Rev. 1.0  
K8P2716UZC  
datasheet NOR FLASH MEMORY  
Table Of Contents  
128Mb C-die Page NOR Flash  
1.0 FEATURES.................................................................................................................................................................5  
2.0 GENERAL DESCRIPTION .........................................................................................................................................5  
3.0 PIN DESCRIPTION ....................................................................................................................................................6  
4.0 56TSOP PIN CONFIGURATION................................................................................................................................7  
5.0 64 Ball FBGA TOP VIEW (BALL DOWN)...................................................................................................................7  
6.0 FUNCTIONAL BLOCK DIAGRAM..............................................................................................................................8  
7.0 ORDERING INFORMATION ......................................................................................................................................9  
8.0 PRODUCT INTRODUCTION......................................................................................................................................10  
9.0 COMMAND DEFINITIONS .........................................................................................................................................11  
10.0 DEVICE OPERATION ..............................................................................................................................................16  
10.1 Read Mode............................................................................................................................................................ 16  
10.2 Standby Mode ....................................................................................................................................................... 16  
10.3 Output Disable....................................................................................................................................................... 16  
10.4 Automatic Sleep Mode .......................................................................................................................................... 16  
10.5 Autoselect Mode.................................................................................................................................................... 16  
10.6 Write (Program/Erase) Mode................................................................................................................................. 17  
10.6.1 Program .......................................................................................................................................................... 17  
10.6.2 Writer Buffer Programming ............................................................................................................................. 18  
10.6.3 Accelerated Program Operation...................................................................................................................... 19  
10.6.4 Unlock Bypass ................................................................................................................................................ 20  
10.6.5 Chip Erase ...................................................................................................................................................... 20  
10.6.6 Block Erase..................................................................................................................................................... 20  
10.7 Erase Suspend / Resume...................................................................................................................................... 21  
10.8 Program Suspend / Resume ................................................................................................................................. 21  
10.9 Write Protect (WP)................................................................................................................................................. 22  
10.10 Software Reset.................................................................................................................................................... 22  
10.11 Hardware Reset................................................................................................................................................... 22  
10.12 Power-up Protection............................................................................................................................................ 23  
10.13 Low Vcc Write Inhibit........................................................................................................................................... 23  
10.14 Write Pulse Glitch Protection............................................................................................................................... 23  
10.15 Logical Inhibit....................................................................................................................................................... 23  
11.0 COMMON FLASH MEMORY INTERFACE..............................................................................................................24  
12.0 OTP BLOCK REGION ..............................................................................................................................................24  
12.1 OTP Block Protection ............................................................................................................................................ 24  
13.0 ENHANCED BLOCK PROTECTION / UNPROTECTION ........................................................................................25  
13.1 Block Protection..................................................................................................................................................... 26  
13.2 Persistent Protection Bits ...................................................................................................................................... 26  
13.3 Dynamic Protection Bits ........................................................................................................................................ 27  
13.4 Persistent Protection Bit Lock Bit .......................................................................................................................... 27  
13.5 Password Protection Method................................................................................................................................. 27  
13.6 Master locking bit set............................................................................................................................................. 27  
14.0 DEVICE STATUS FLAGS.........................................................................................................................................36  
15.0 ABSOLUTE MAXIMUM RATINGS ...........................................................................................................................39  
16.0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND ).........................................................39  
17.0 DC CHARACTERISTICS..........................................................................................................................................40  
18.0 CAPACITANCE(TA = 25 °C, VCC = 3.0V, f = 1.0MHz)............................................................................................40  
19.0 AC TEST CONDITION..............................................................................................................................................41  
20.0 AC CHARACTERISTICS..........................................................................................................................................41  
20.1 Read Operations ................................................................................................................................................... 41  
20.2 Write(Erase/Program)Operations.......................................................................................................................... 44  
- 3 -  

与K8P2716UZC-JC4D0相关器件

型号 品牌 获取价格 描述 数据表
K8P2716UZC-JC4DT SAMSUNG

获取价格

EEPROM Card, 8MX16, 70ns, Parallel, CMOS, PBGA64
K8P2716UZC-JC4E0 SAMSUNG

获取价格

Flash, 8MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64
K8P2716UZC-JC4ET SAMSUNG

获取价格

EEPROM Card, 8MX16, 80ns, Parallel, CMOS, PBGA64
K8P2716UZC-JE4C0 SAMSUNG

获取价格

Flash, 8MX16, 65ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64
K8P2716UZC-JE4CT SAMSUNG

获取价格

EEPROM Card, 8MX16, 65ns, Parallel, CMOS, PBGA64
K8P2716UZC-JE4D0 SAMSUNG

获取价格

Flash, 8MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64
K8P2716UZC-JE4DT SAMSUNG

获取价格

EEPROM Card, 8MX16, 70ns, Parallel, CMOS, PBGA64
K8P2716UZC-JE4E0 SAMSUNG

获取价格

Flash, 8MX16, 80ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64
K8P2716UZC-JE4ET SAMSUNG

获取价格

EEPROM Card, 8MX16, 80ns, Parallel, CMOS, PBGA64
K8P2716UZC-JI4C0 SAMSUNG

获取价格

Flash, 8MX16, 65ns, PBGA64, 11 X 13 MM, 1 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-64