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K7A803600B-QC14 PDF预览

K7A803600B-QC14

更新时间: 2024-01-23 01:11:34
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
18页 401K
描述
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM

K7A803600B-QC14 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.89Is Samacsys:N
最长访问时间:3.8 ns最大时钟频率 (fCLK):138 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:36功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.06 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.3 mA
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

K7A803600B-QC14 数据手册

 浏览型号K7A803600B-QC14的Datasheet PDF文件第2页浏览型号K7A803600B-QC14的Datasheet PDF文件第3页浏览型号K7A803600B-QC14的Datasheet PDF文件第4页浏览型号K7A803600B-QC14的Datasheet PDF文件第5页浏览型号K7A803600B-QC14的Datasheet PDF文件第6页浏览型号K7A803600B-QC14的Datasheet PDF文件第7页 
K7A803609B  
K7A801809B  
256Kx36 & 512Kx18 Synchronous SRAM  
Document Title  
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM  
Revision History  
Rev. No.  
History  
Draft Date  
Remark  
0.0  
0.1  
0.2  
0.3  
1.0  
Initial draft  
May. 18 . 2001  
Preliminary  
1. Delete pass- through  
June. 26. 2001 Preliminary  
1. Add x32 org part and industrial temperature part  
1. change scan order(1) form 4T to 6T at 119BGA(x18)  
Aug. 11. 2001  
Aug. 28. 2001  
Nov. 16. 2001  
Preliminary  
Preliminary  
Final  
1. Final spec release  
2. Change ISB2 form 50mA to 60mA  
2.0  
2.1  
3.0  
Remove tCYC 225MHz(-22)  
1. Delete 119BGA package  
April. 01. 2002 Final  
April. 04. 2003 Final  
1. Remove x32 organization  
2. Remove -20 speed bin  
Nov. 17. 2003  
Final  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
- 1 -  
Nov. 2003  
Rev 3.0  

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