K4X56163PI - L(F)E/G
Mobile DDR SDRAM
16Mx16 Mobile DDR SDRAM
1. FEATURES
• VDD/VDDQ = 1.8V/1.8V
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe(DQS)
• Four banks operation
• Differential clock inputs(CK and CK)
• MRS cycle with address key programs
- CAS Latency ( 2, 3 )
- Burst Length ( 2, 4, 8, 16 )
- Burst Type (Sequential & Interleave)
• EMRS cycle with address key programs
- Partial Array Self Refresh ( Full, 1/2, 1/4 Array )
- Output Driver Strength Control ( Full, 1/2, 1/4, 1/8 )
• Internal Temperature Compensated Self Refresh
• All inputs except data & DM are sampled at the positive going edge of the system clock(CK).
• Data I/O transactions on both edges of data strobe, DM for masking.
• Edge aligned data output, center aligned data input.
• No DLL; CK to DQS is not synchronized.
• DM0 - DM3 for write masking only.
• Auto refresh duty cycle
- 7.8us for -25 to 85 °C
2. Operating Frequency
DDR333
DDR266
83Mhz
Speed @CL21)
83Mhz
Speed @CL31)
166Mhz
133Mhz
NOTE :
1) CAS Latency
3. Address configuration
Organization
Bank Address
Row Address
Column Address
16Mx16
BA0,BA1
A0 - A12
A0 - A8
- DM is internally loaded to match DQ and DQS identically.
4. Ordering Information
Part No.
Max Freq.
Interface
LVCMOS
Package
K4X56163PI-L(F)E/GC6
K4X56163PI-L(F)E/GC3
166MHz(CL=3),83MHz(CL=2)
133MHz(CL=3),83MHz(CL=2)
60FBGA
Pb (Pb Free)
- L(F)E : 60FBGA Pb(Pb Free), Normal Power, Extended Temperature(-25 °C ~ 85 °C)
- L(F)G : 60FBGA Pb(Pb Free), Low Power, Extended Temperature(-25 °C ~ 85 °C)
- C6/C3 : 166MHz(CL=3) / 133MHz(CL=3)
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INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS"
BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in
loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
October 2007
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