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K4S280832D-NL7C PDF预览

K4S280832D-NL7C

更新时间: 2024-01-26 19:14:13
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 113K
描述
Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.441 INCH, 0.40 MM PITCH, STSOP2-54

K4S280832D-NL7C 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP,针数:54
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.83
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G54
长度:11.2 mm内存密度:134217728 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:54字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.4 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

K4S280832D-NL7C 数据手册

 浏览型号K4S280832D-NL7C的Datasheet PDF文件第4页浏览型号K4S280832D-NL7C的Datasheet PDF文件第5页浏览型号K4S280832D-NL7C的Datasheet PDF文件第6页浏览型号K4S280832D-NL7C的Datasheet PDF文件第8页浏览型号K4S280832D-NL7C的Datasheet PDF文件第9页浏览型号K4S280832D-NL7C的Datasheet PDF文件第10页 
K4S280832D  
CMOS SDRAM  
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)  
Parameter  
AC input levels (Vih/Vil)  
Value  
2.4/0.4  
1.4  
Unit  
V
Input timing measurement reference level  
Input rise and fall time  
V
tr/tf = 1/1  
1.4  
ns  
V
Output timing measurement reference level  
Output load condition  
See Fig. 2  
Vtt = 1.4V  
3.3V  
50W  
1200W  
VOH (DC) = 2.4V, IOH = -2mA  
VOL (DC) = 0.4V, IOL = 2mA  
Z0 = 50W  
Output  
Output  
50pF  
50pF  
870W  
(Fig. 1) DC output load circuit  
(Fig. 2) AC output load circuit  
OPERATING AC PARAMETER  
(AC operating conditions unless otherwise noted)  
Version  
Parameter  
Symbol  
Unit  
Note  
- 7C  
15  
- 75  
15  
- 1H  
20  
-1L  
20  
20  
20  
50  
Row active to row active delay  
RAS to CAS delay  
tRRD(min)  
tRCD(min)  
tRP(min)  
ns  
ns  
1
1
1
1
15  
20  
20  
Row precharge time  
15  
20  
20  
ns  
tRAS(min)  
tRAS(max)  
tRC(min)  
45  
45  
50  
ns  
Row active time  
100  
2
us  
Row cycle time  
60  
65  
70  
70  
ns  
1
2,5  
5
Last data in to row precharge  
Last data in to Active delay  
Last data in to new col. address delay  
Last data in to burst stop  
tRDL(min)  
tDAL(min)  
tCDL(min)  
tBDL(min)  
tCCD(min)  
CLK  
-
2 CLK + tRP  
1
1
1
2
1
CLK  
CLK  
CLK  
2
2
Col. address to col. address delay  
3
CAS latency=3  
CAS latency=2  
Number of valid output data  
ea  
4
Notes :  
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time  
and then rounding off to the next higher integer.  
2. Minimum delay is required to complete write.  
3. All parts allow every cycle column address change.  
4. In case of row precharge interrupt, auto precharge and read burst stop.  
5. In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported.  
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP.  
Rev. 0.1 Sept. 2001  

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