是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | FBGA, BGA90,9X15,32 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 5.4 ns | 最大时钟频率 (fCLK): | 133 MHz |
I/O 类型: | COMMON | 交错的突发长度: | 1,2,4,8 |
JESD-30 代码: | R-PBGA-B90 | JESD-609代码: | e3 |
内存密度: | 268435456 bit | 内存集成电路类型: | SYNCHRONOUS DRAM |
内存宽度: | 32 | 湿度敏感等级: | 1 |
端子数量: | 90 | 字数: | 8388608 words |
字数代码: | 8000000 | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 组织: | 8MX32 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA90,9X15,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, FINE PITCH | 峰值回流温度(摄氏度): | 225 |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
刷新周期: | 4096 | 连续突发长度: | 1,2,4,8,FP |
最大待机电流: | 0.001 A | 子类别: | DRAMs |
最大压摆率: | 0.16 mA | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | MATTE TIN | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4M563233G-HN60 | SAMSUNG |
获取价格 |
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90 | |
K4M563233G-HN600 | SAMSUNG |
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Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 | |
K4M563233G-HN750 | SAMSUNG |
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Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 | |
K4M56323LD-EN1L | SAMSUNG |
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Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, FBGA-90 | |
K4M56323LD-ES80 | SAMSUNG |
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Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90 | |
K4M56323LD-MUP1L | SAMSUNG |
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Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, FBGA-90 | |
K4M56323LE | SAMSUNG |
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2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M56323LE-EC1H | SAMSUNG |
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2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M56323LE-EC1L | SAMSUNG |
获取价格 |
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M56323LE-EC1L0 | SAMSUNG |
获取价格 |
Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, 0.80 MM PITCH, LEAD FREE, FBGA-90 |