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K4M563233G-HG7LT PDF预览

K4M563233G-HG7LT

更新时间: 2024-02-18 22:14:43
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器内存集成电路
页数 文件大小 规格书
12页 143K
描述
Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90

K4M563233G-HG7LT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FBGA, BGA90,9X15,32
Reach Compliance Code:unknown风险等级:5.84
最长访问时间:5.4 ns最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PBGA-B90JESD-609代码:e3
内存密度:268435456 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:32湿度敏感等级:1
端子数量:90字数:8388608 words
字数代码:8000000最高工作温度:85 °C
最低工作温度:-25 °C组织:8MX32
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA90,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH峰值回流温度(摄氏度):225
电源:3/3.3 V认证状态:Not Qualified
刷新周期:4096连续突发长度:1,2,4,8,FP
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.16 mA表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:MATTE TIN端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

K4M563233G-HG7LT 数据手册

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K4M563233G - F(H)N/G/L/F  
Mobile-SDRAM  
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 3.0V & 3.3V power supply.  
The K4M563233G is 268,435,456 bits synchronous high data  
rate Dynamic RAM organized as 4 x 2,097,152 words by 32 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 90Balls FBGA ( -FXXX -Pb, -HXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M563233G-F(H)N/G/L/F60  
166MHz(CL=3)  
90 FBGA Pb  
(Pb Free)  
LVCMOS  
K4M563233G-F(H)N/G/L/F75  
K4M563233G-F(H)N/G/L/F7L*1  
133MHz(CL=3), 111MHz(CL=2)  
133MHz(CL=3), 83MHz(CL=2)  
- F(H)N/G : Low Power, Extended Temperature(-25°C ~ 85°C)  
- F(H)L/F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
NOTES :  
1. In case of 40MHz Frequency, CL1 can be supported.  
Address configuration  
Organization  
Bank  
Row  
Column Address  
8Mx32  
BA0,BA1  
A0 - A11  
A0 - A8  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-  
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could  
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-  
visions may apply.  
February 2006  

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