JCT620E
JieJie Microelectronics Co., Ltd.
FIG.1 Maximum power dissipation versus
FIG.2: RMS on-state current versus case
RMS on-state current
temperature
IT(RMS)(A)
P(W)
35
22
88℃
20
30
25
20
15
10
5
18
16
14
12
10
8
6
4
2
0
0
0
4
8
12
16
20
24
0
25
50
75
100
125
IT(RMS)(A)
TC(℃)
FIG.3: RMS on-state current versus ambient
temperature (printed circuit board FR4,copper
thickness:35μm)(full cycle)
FIG.4: Surge peak on-state current versus
number of cycles
ITSM(A)
IT(RMS)(A)
300
2.5
Tc=25℃,tp=10ms,one cycle,half-sine
250
200
150
100
50
2
1.5
1
0.5
0
0
0
25
50
75
100
125
1.E+0
1.E+1
1.E+2
1.E+3
1.E+4
1.E+5
Ta(℃)
Number of cycles
FIG.5: On-state characteristics
FIG.6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp<10ms, and corresponding value of I2t
(dI/dt<150A/μs)
SHNCDJDFKVFKPJDFGPSDJFPAJFJOFJOJ
SOPGJOPRJGJOSDHSDHHHSEHUISHFSUI
H
ITSM(A), I2t(A2s)
ITM(A)
100
Tj=25℃ typ
Tj=25℃ max
Tj=125℃ typ
ITSM
1000
dI/dt
I2t
100
10
1
10
1
0
0.5
1
1.5
2
2.5
0.01
0.1
1
10
tp(ms)
VTM(V)
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http://www.jjwdz.com
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