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JANTXV1N5527BURTR-1 PDF预览

JANTXV1N5527BURTR-1

更新时间: 2024-11-30 23:12:55
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管
页数 文件大小 规格书
3页 188K
描述
Low Voltage Surface Mount 500 mW Avalanche Diodes

JANTXV1N5527BURTR-1 数据手册

 浏览型号JANTXV1N5527BURTR-1的Datasheet PDF文件第2页浏览型号JANTXV1N5527BURTR-1的Datasheet PDF文件第3页 
IN5518BUR-1 thru 1N5546BUR-1  
(or MLL5518B-1 thru MLL5546B-1)  
Low Voltage Surface Mount  
500 mW Avalanche Diodes  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface  
mount Zener voltage regulators provides a selection from 3.3 to 33 volts in  
standard 5% tolerances as well as tighter tolerances identified by different  
suffix letters on the part number. These have an internal-metallurgical-bond  
option as identified by the “–1” suffix. This internally bonded Zener package  
construction is also in JAN, JANTX, and JANTXV military qualifications.  
Microsemi also offers numerous other Zener products to meet higher and  
lower power applications.  
DO-213AA  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to JEDEC registered  
Regulates voltage over a broad operating current  
1N5518 thru 1N5546 series  
and temperature range  
Internal metallurgical bond with the “-1” suffix  
Extensive selection from 3.3 to 33 V  
Also available in JAN, JANTX, and JANTXV  
qualifications per MIL-PRF-19500/437 by adding  
the JAN, JANTX, or JANTXV prefixes to part  
numbers for desired level of screening; (e.g.  
JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.)  
Nonbonded types also available without the “-1”  
suffix for both the axial and surface mount  
packages  
DO-7 or DO-35 glass body axial-leaded Zener  
equivalents also available per JEDEC registration  
with part numbers 1N5518 thru 1N5546 on  
separate data sheets  
Standard voltage tolerances are plus/minus 5% with  
a “B” suffix, e.g. 1N5518BUR-1, etc.  
Tight tolerances available in plus or minus 2% or 1%  
with C or D suffix respectively, e.g. 1N5518CUR-1,  
1N5518DUR-1, etc.  
Hermetically sealed surface mount package  
Nonsensitive to ESD per MIL-STD-750 Method 1020  
Minimal capacitance (see Figure 3)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating and Storage temperature: -65ºC to  
CASE: Hermetically sealed glass DO-213AA  
+175ºC  
(SOD80 or MLL34) MELF style package  
Thermal Resistance: 100 ºC/W junction to end cap,  
or 250ºC/W junction to ambient when mounted on  
FR4 PC board (1 oz Cu) with recommended  
footprint (see last page)  
Steady-State Power: 0.5 watts at end cap  
temperature TEC < 125oC or at ambient TA < 50ºC  
when mounted on FR4 PC board as described for  
thermal resistance above (see Figure 2 for  
derating)  
TERMINALS: End caps tin-lead plated solderable  
per MIL-STD-750, method 2026  
POLARITY: Cathode indicated by band where  
diode is to be operated with the banded end positive  
with respect to the opposite end for Zener regulation  
MARKING: cathode band only  
TAPE & REEL option: Standard per EIA-481-1-A  
with 12 mm tape, 2000 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
WEIGHT: 0.04 grams  
See package dimensions on last page  
Forward voltage @200 mA: 1.1 volts  
Solder Temperatures: 260 ºC for 10 s (max)  
Copyright 2003  
Microsemi  
Page 1  
10-31-2003 REV B  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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