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JA4487-AL

更新时间: 2024-11-22 01:13:51
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线艺 - COILCRAFT /
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描述
SMT Power Inductors

JA4487-AL 数据手册

  
Document 941  
For Texas Instruments  
SolarMagic Power Optimizer  
SMT Power Inductors  
• Developed for Texas Instruments SolarMagic™ Power  
Optimizer SM3320 series  
• JA4487-AL is designed for 30 V to 100 V panels; JA4488-AL  
is designed for low voltage panels (<50 V)  
• High current, low DCR, shielded power inductors  
• Recessed board placement for a very low profile design  
Core material Ferrite  
Terminations RoHS compliant tin-silver over tin over nickel over  
phos bronze. Other terminations available at additional cost.  
Weight 36.8 – 39.0 g  
Ambient temperature –40°C to +125°C  
Storage temperature Component: –40°C to +125°C.  
Tray packaging: –40°C to +80°C  
Resistance to soldering heat Max three 40 second reflows at  
+260°C, parts cooled to room temperature between cycles  
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /  
85% relative humidity)  
Failures in Time (FIT) / Mean Time Between Failures (MTBF)  
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332  
Packaging 24 per tray  
PCB washing Tested with pure water or alcohol only. For other  
solvents, see Doc787_PCB_Washing.pdf  
Irms (A)4  
Inductance Inductance  
DCR  
max3  
Part  
number  
at 0 A1  
at Ipk2  
Ipk2 20°C 40°C  
±±0ꢀ (ꢁµ)  
min (ꢁµ) (mOhms) (A)  
rise rise  
JA4487-AL  
JA4488-AL  
30  
20  
26  
18  
10.0  
11.0  
10.0  
15.0  
11.0 14.4  
9.5 13.0  
PC board  
1. Inductance measured at 200 kHz, 1.0 Vrms, 0 Adc using an Agilent/HP 4263B  
impedance analyzer or equivalent.  
0.50  
12,7  
max  
2. Peak primary current drawn at minimum input voltage.  
3. DCR is with all windings connected in parallel.  
4. Current that causes the specified temperature rise from 25°C ambient. This infor-  
mation is for reference only and does not represent absolute maximum ratings  
1.220  
31,0  
0.126  
3,2  
1.339  
34,0  
5. Electrical specifications at 25°C.  
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.  
1.48  
37,7  
0.146  
3,7  
1.260  
32,0  
max  
1
2
3
4
5
6
0.083  
2,1  
0.039  
1,0  
6
7
7
6
1.236  
31,4  
1.22  
31,0  
1.236  
31,4 cutout  
Board  
max  
7
8
9
10  
11  
12  
1
1
12  
12  
0.177  
4,5  
0.177  
4,5  
Windings to be connected  
in parallel on the PC board  
Recommended  
Land Pattern  
(Viewed from underside  
of PC board)  
White mark  
indicates pin 1  
inches  
mm  
Dimensions are in  
For lowest profile, these parts are designed to  
be mounted to the underside of the PC board.  
Document 941 Revised 11/19/15  

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