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| 生命周期： | Contact Manufacturer | 包装说明： | , |
| Reach Compliance Code： | unknown | 风险等级： | 5.62 |
| Base Number Matches： | 1 |
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| IT38HX | HUTSON |
获取价格 |
4 Quadrant Logic Level TRIAC, 300V V(DRM), 8A I(T)RMS, TO-220AB, HERMETIC SEALED, TO-220, |
|
| IT3D-100P-17H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-20H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-22H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-25H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-26H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-28H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-30H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-32H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
| IT3D-100P-38H03 | HRS |
获取价格 |
High-Speed(10+Gbps) BGA Mezzanine Connectors |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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