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IT3-200P-32H(04) PDF预览

IT3-200P-32H(04)

更新时间: 2024-11-20 18:43:19
品牌 Logo 应用领域
广濑 - HRS /
页数 文件大小 规格书
16页 1793K
描述
CONN INTERPOSER 200POS 32MM

IT3-200P-32H(04) 技术参数

是否无铅: 不含铅生命周期:Active
Reach Compliance Code:unknown风险等级:5.78
Base Number Matches:1

IT3-200P-32H(04) 数据手册

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+
High-Speed(10 Gbps) BGA Mezzanine Connectors  
IT3 Series  
Flexibility  
Hirose’s IT3 mezzanine connector system is as  
comfortable in today’s data rates of PCIe and  
+
XAUI as it is in tomorrow’s 10 Gbps systems.  
With the ability to transmit differential, single-  
ended, and power through one package and  
being stackable from 14 – 40mm, IT3 can solve  
your interface needs for both current and future  
generations.  
Mechanical features  
Unique 3-piece structure for flexibility  
Stacking heights from 14 to 40mm  
Staggered 1.5mm 1.75mm ball grid array  
Number of Contacts: 100, 200, &300 signals  
+ 90% additional grounds  
Interposer  
Signal Ground  
Differential, single-ended, and power  
Low mating/extracting forces  
Wide misalignment tolerances for multiple  
connector use  
Both of SnPb and Pb-free are available  
Excellent reflow solderability  
Signal / Ground Configuration  
IT3 is inter-mateable with IT5 Series  
Signal integrity features  
Insertion loss to Crosstalk Ratio (ICR)  
The ICR performance meets the  
extrapolated IEEE 802.3ap  
specification for 6.25Gbps with  
fully-populated pin assignment,  
60  
50  
40  
30  
20  
10  
0
0
ICR  
IEEE spec  
-10  
-20  
-30  
+
and 10 Gbps with skipped pin  
assignment.  
-40  
Return Loss  
RL  
IEEE Spec  
The differential return loss meets  
the extrapolated IEEE 802.3ap  
specification up to 12GHz.  
-50  
0
5
10  
15  
20  
0
5
10  
15  
20  
Frequency (GHz)  
Frequency (GHz)  
Stacking height variations  
2piece  
3piece  
Stacking Height  
14  
15  
17  
18  
20  
22  
25  
26  
28  
30  
32  
35  
38  
40  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
mm  
Contact Position  
100  
200  
300  
*
*
* : Under planning  
1
2017.10  

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