是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | HVQCCN, | Reach Compliance Code: | compliant |
风险等级: | 5.69 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PQCC-N16 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 3 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 6.25 V |
最小供电电压 (Vsup): | 4.3 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
宽度: | 3 mm | Base Number Matches: | 1 |
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