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ISL71090SEHVF25 PDF预览

ISL71090SEHVF25

更新时间: 2024-02-07 15:46:42
品牌 Logo 应用领域
英特矽尔 - INTERSIL /
页数 文件大小 规格书
10页 388K
描述
Radiation Hardened Ultra Low Noise, Precision Voltage Reference

ISL71090SEHVF25 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:DFP,Reach Compliance Code:compliant
ECCN代码:USML XV(E)HTS代码:8542.39.00.01
风险等级:5.81Is Samacsys:N
模拟集成电路 - 其他类型:THREE TERMINAL VOLTAGE REFERENCEJESD-30 代码:R-CDFP-F8
长度:6.485 mm功能数量:1
输出次数:1端子数量:8
最高工作温度:125 °C最低工作温度:-55 °C
最大输出电压:2.5012 V最小输出电压:2.4987 V
标称输出电压:2.5 V封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK座面最大高度:2.79 mm
最大供电电压 (Vsup):30 V最小供电电压 (Vsup):4 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BIPOLAR最大电压温度系数:10 ppm/ °C
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
总剂量:100k Rad(Si) V微调/可调输出:YES
宽度:6.475 mmBase Number Matches:1

ISL71090SEHVF25 数据手册

 浏览型号ISL71090SEHVF25的Datasheet PDF文件第4页浏览型号ISL71090SEHVF25的Datasheet PDF文件第5页浏览型号ISL71090SEHVF25的Datasheet PDF文件第6页浏览型号ISL71090SEHVF25的Datasheet PDF文件第8页浏览型号ISL71090SEHVF25的Datasheet PDF文件第9页浏览型号ISL71090SEHVF25的Datasheet PDF文件第10页 
ISL71090SEH25  
Output Voltage Adjustment  
Device Operation  
The output voltage can be adjusted above and below the  
factory-calibrated value via the trim terminal. The trim terminal is  
the negative feedback divider point of the output op amp. The  
positive input of the amplifier is about 1.216V, and in feedback,  
so will be the trim voltage. The suggested method to adjust the  
output is to connect a 1Mexternal resistor directly to the trim  
terminal and connect the other end to the wiper of a  
Bandgap Precision Reference  
The ISL71090SEH25 uses a bandgap architecture and special  
trimming circuitry to produce a temperature compensated,  
precision voltage reference with high input voltage capability and  
moderate output current drive.  
potentiometer that has a 100kresistance and whose outer  
terminals connect to VOUT and ground. If a 1Mresistor is  
connected to trim, the output adjust range will be ±6.3mV. The  
TRIM pin should not have any capacitor tied to its output, also it  
is important to minimize the capacitance on the trim terminal  
during layout to preserve output amplifier stability. It is also best  
to connect the series resistor directly to the trim terminal, to  
minimize that capacitance and also to minimize noise injection.  
Small trim adjustments will not disturb the factory-set  
temperature coefficient of the reference, but trimming near the  
extreme values can.  
Applications Information  
Board Mounting Considerations  
For applications requiring the highest accuracy, board mounting  
location should be reviewed. The device uses a ceramic flatpack  
package. Generally, mild stresses to the die when the printed  
circuit (PC) board is heated and cooled, can slightly change the  
shape. Because of these die stresses, placing the device in areas  
subject to slight twisting can cause degradation of reference  
voltage accuracy. It is normally best to place the device near the  
edge of a board, or on the shortest side, because the axis of  
bending is most limited in that location. Mounting the device in a  
cutout also minimizes flex. Obviously, mounting the device on  
flexprint or extremely thin PC material will likewise cause loss of  
reference accuracy.  
Output Stage  
The output stage of the device has a push pull configuration with  
an high side PNP and a low side NPN. This helps the device to act  
as a source and sink. The device can source 20mA and sink  
10mA.  
Board Assembly Considerations  
Some PC board assembly precautions are necessary. Normal  
output voltage shifts of typically 100µV can be expected with  
Pb-free reflow profiles or wave solder on multi-layer FR4 PC  
boards. Precautions should be taken to avoid excessive heat or  
extended exposure to high reflow or wave solder temperatures.  
Use of COMP Cap  
The reference can be compensated for the COUT capacitors used  
by adding a capacitor from COMP pin to GND. See Table 1 for  
recommended values. of the COMP capacitor.  
TABLE 1.  
Noise Performance and Reduction  
COUT  
(µF)  
CCOMP  
(nF)  
The output noise voltage over the 0.1Hz to 10Hz bandwidth is  
typically 2µVP-P (VOUT = 2.5V). The noise measurement is made  
with a 9.9Hz bandpass filter. Noise in the 10Hz to 1kHz  
bandwidth is approximately 1.6µVRMS (VOUT = 2.5V), with 0.1µF  
capacitance on the output. This noise measurement is made  
with a band pass filter of 990Hz. Load capacitance up to 10µF  
(with COMP) can be added but will result in only marginal  
improvements in output noise and transient response.  
0.1  
1
1
1
10  
10  
SEE Testing  
The device was tested under ion beam at an LET of  
86MeV•cm2/mg. The device did not latch up or burn out to a  
VDD of 36V and at +125°C. Single Event transients were  
observed and are summarized in the Table 2:  
Turn-On Time  
Normal turn-on time is typically 150µs, the circuit designer must  
take this into account when looking at power-up delays or  
sequencing.  
TABLE 2.  
Temperature Coefficient  
VIN  
(V)  
IOUT  
(A)  
COUT  
(µF)  
SET  
(% VOUT  
The limits stated for temperature coefficient (Tempco) are  
governed by the method of measurement. The overwhelming  
standard for specifying the temperature drift of a reference is to  
measure the reference voltage at two temperatures which  
provide for the maximum voltage deviation and take the total  
variation, (VHIGH - VLOW), this is then divided by the temperature  
extremes of measurement (THIGH – TLOW). The result is divided by  
the nominal reference voltage (at T = +25°C) and multiplied by  
106 to yield ppm/°C. This is the “Box” method for specifying  
temperature coefficient.  
)
4
5
5
5
1
1
-4.6  
-4.4  
-1.0  
30  
30  
10  
DNC Pins  
These pins are for trimming purpose and for factory use only. Do  
not connect these to the circuit in any way. It will adversely effect  
the performance of the reference.  
FN8451.0  
June 6, 2013  
7

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