Datasheet > ISL705BEHVX

ISL705BEHVX

更新时间： 2024-02-07 00:01:16

品牌	Logo	应用领域
英特矽尔 - INTERSIL		信息通信管理
页数	文件大小	规格书
19页	1152K
描述
Rad-Hard, 5.0V/3.3V Î¼-Processor Supervisory Circuits

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技术参数
数据手册

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ISL705BEHVX 技术参数

生命周期：	Transferred	包装说明：	DIE,
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.66
其他特性：	RESET THRESHOLD VOLTAGE IS 4.65	可调阈值：	NO
模拟集成电路 - 其他类型：	POWER SUPPLY MANAGEMENT CIRCUIT	JESD-30 代码：	R-XUUC-N10
信道数量：	1	功能数量：	1
端子数量：	10	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	UNSPECIFIED
封装代码：	DIE	封装形状：	RECTANGULAR
封装形式：	UNCASED CHIP	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.75 V	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	技术：	BICMOS
温度等级：	MILITARY	端子形式：	NO LEAD
端子位置：	UPPER	总剂量：	100k Rad(Si) V
Base Number Matches：	1

ISL705BEHVX 数据手册

ISL705AEH, ISL705BEH, ISL705CEH, ISL706AEH, ISL706BEH, ISL706CEH

Package Outline Drawing

K8.A

8 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

Rev 2, 12/10

PIN NO. 1

ID OPTIONAL

0.015 (0.38)

0.008 (0.20)

0.050 (1.27 BSC)

0.005 (0.13)

0.265 (6.73)

0.245 (6.22)

MIN

PIN NO. 1

ID AREA

0.022 (0.56)

0.015 (0.38)

TOP VIEW

0.115 (2.92)

0.070 (1.18)

0.045 (1.14)

0.026 (0.66)

0.09 (0.23)

0.04 (0.10)

0.265 (6.75)

0.245 (6.22)

-D-

-H-

-C-

0.180 (4.57)

0.170 (4.32)

0.370 (9.40)

0.250 (6.35)

SEATING AND

BASE PLANE

0.03 (0.76) MIN

SIDE VIEW

0.007 (0.18)

0.004 (0.10)

NOTES:

LEAD FINISH

Index area: A notch or a pin one identification mark shall be located

adjacent to pin one and shall be located within the shaded area shown.

The manufacturer’s identification shall not be used as a pin one

identification mark. Alternately, a tab may be used to identify pin one.

0.009 (0.23)

0.004 (0.10)

BASE

METAL

2. If a pin one identification mark is used in addition to a tab, the limits

of the tab dimension do not apply.

0.019 (0.48)

0.015 (0.38)

3. The maximum limits of lead dimensions (section A-A) shall be

measured at the centroid of the finished lead surfaces, when solder

dip or tin plate lead finish is applied.

0.0015 (0.04)

MAX

0.022 (0.56)

0.015 (0.38)

4. Measure dimension at all four corners.

5. For bottom-brazed lead packages, no organic or polymeric materials

shall be molded to the bottom of the package to cover the leads.

SECTION A-A

6. Dimension shall be measured at the point of exit (beyond the

meniscus) of the lead from the body. Dimension minimum shall

be reduced by 0.0015 inch (0.038mm) maximum when solder dip

lead finish is applied.

7. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

8. Controlling dimension: INCH.

FN8262.0

March 30, 2012

1...16 17 1819

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