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ISL6455, ISL6455A
Triple Output Regulator with Single Synchronous Buck and Dual LDO
FN9196
Rev 1.00
Feb 19, 2014
The ISL6455 is a highly integrated triple output regulator
which provides a single chip solution for FPGAs and wireless
Features
• Fully integrated synchronous buck regulator + dual LDO
chipset power management. The device integrates an
adjustable high efficiency synchronous buck regulator with
two adjustable ultra low noise LDO regulators. Either the
ISL6455 or ISL6455A can be selected based on whether
3.3V ±10% or 5V ±10% is required as an input voltage.
• PWM output voltage adjustable.
- 0.8V to 2.5V with ISL6455 (VIN = 3.3V)
- 0.8V to 3.3V with ISL6455A (VIN = 5.0V)
• High output current. . . . . . . . . . . . . . . . . . . . . . . . . 600mA
The synchronous current mode control PWM regulator with
integrated N- Channel and P-Channel power MOSFET
provides adjustable voltages based on external resistor
setting. Synchronous rectification with internal MOSFETs is
used to achieve higher efficiency and reduced number of
external components. Operating frequency is typically
750kHz, allowing the use of smaller inductor and capacitor
values. The device can be synchronized to an external clock
signal in the range of 500kHz to 1MHz. The PG_PWM
output indicates loss of regulation on PWM output.
• Dual LDO adjustable options
- LDO1, 1.2V to Vin - 0.3V (3.3Vmax). . . . . . . . . . 300mA
- LDO2, 1.2V to Vin - 0.3V (3.3Vmax). . . . . . . . . . 300mA
• Ultra-compact DC/DC converter design
• Stable with small ceramic output capacitors and no load
• High conversion efficiency
• Low shutdown supply current
• Low dropout voltage for LDOs
- LDO1 . . . . . . . . . . . . . . . . . . 150mV (typical) at 300mA
- LDO2 . . . . . . . . . . . . . . . . . . 150mV (typical) at 300mA
The ISL6455 also has two LDO adjustable regulators using
internal PMOS transistors as pass devices. LDO2 features
ultra low noise typically below 30µV
to aid VCO stability.
• Low output voltage noise
RMS
The EN_LDO pin controls LDO1 and LDO2 outputs. The
ISL6455 also integrates a RESET function, which eliminates
the need for additional RESET IC required in WLAN and
other applications. The IC asserts a RESET signal whenever
- <30µV
(typical) for LDO2 (VCO supply)
RMS
• PG_LDO and PG_PWM (PWM and LDO) outputs
• Extensive circuit protection and monitoring features
- PWM overvoltage protection
- Overcurrent protection
the V supply voltage drops below a preset threshold,
IN
keeping it asserted for at least 25ms after V has risen
IN
above the reset threshold. The PG_LDO output indicates
loss of regulation on either of the two LDO outputs. Other
features include overcurrent protection and thermal
shutdown for all of the three outputs. High integration and
the thin Quad Flat No-lead (QFN) package makes ISL6455
an ideal choice for powering FPGAs and small form factor
wireless cards such as PCMCIA, mini-PCI and Cardbus-32.
- Shutdown
- Thermal shutdown
• Integrated RESET output for microprocessor reset
• Proven reference design for total WLAN system solution
• QFN package
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat
No Leads - Product Outline
Ordering Information
- Near Chip-Scale package footprint Improves PCB
efficiency and is thinner in Profile
PART NUMBER*
(Note)
PART
TEMP.
PACKAGE
PKG.
MARKING RANGE (°C) (Pb-Free) DWG. #
• Pb-free (RoHS compliant)
ISL6455IRZ
64 55IRZ -40 to +85 24 Ld QFN L24.4x4B
64 55AIRZ -40 to +85 24 Ld QFN L24.4x4B
Applications
ISL6455AIRZ
Add “-TK” or T5K suffix for tape and reel. Please refer to TB347 for
details on reel specifications.
• WLAN cards
- PCMCIA, Cardbus32, MiniPCI cards
- Compact flash cards
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach
materials and 100% matte tin plate PLUS ANNEAL - e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the
Pb-free requirements of IPC/JEDEC J STD-020.
• Hand-held instruments
Related Literature
• TB363 - Guidelines for Handling and Processing Moisture
Sensitive Surface Mount Devices (SMDs)
• TB389 - PCB Land Pattern Design and Surface Mount
Guidelines for QFN Packages
FN9196 Rev 1.00
Feb 19, 2014
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