生命周期: | Transferred | 包装说明: | DIE, |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.17 | Is Samacsys: | N |
应用: | PUSH BUTTON AND MESSAGE CUEING | 商用集成电路类型: | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码: | X-XUUC-N28 | 功能数量: | 1 |
端子数量: | 28 | 片上内存类型: | EEPROM |
最高工作温度: | 50 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | UNSPECIFIED | 封装形式: | UNCASED CHIP |
认证状态: | Not Qualified | 最长读取时间: | 62 s |
最大供电电压 (Vsup): | 6.5 V | 最小供电电压 (Vsup): | 4.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | NO LEAD |
端子位置: | UPPER | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ISD2560S | WINBOND | Speech Synthesizer With RCDG, 60s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 |
获取价格 |
|
ISD2560SI | ETC | Solid-State Recorder |
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|
ISD2560SY | WINBOND | Speech Synthesizer With RCDG, 60s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 |
获取价格 |
|
ISD2560T | WINBOND | Consumer IC |
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|
ISD2560TI | WINBOND | Consumer IC |
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|
ISD2560X | WINBOND | Speech Synthesizer With RCDG, 60s, CMOS, DIE-28 |
获取价格 |