是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | SOP, SOP28,.4 |
针数: | 28 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.14 |
Is Samacsys: | N | 应用: | CAR STEREO; HANDSET; TRANSFORMER |
商用集成电路类型: | SPEECH SYNTHESIZER WITH RCDG | JESD-30 代码: | R-PDSO-G28 |
JESD-609代码: | e0 | 长度: | 17.93 mm |
功能数量: | 1 | 端子数量: | 28 |
片上内存类型: | EEPROM | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | SOP | 封装等效代码: | SOP28,.4 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
认证状态: | Not Qualified | 最长读取时间: | 60 s |
座面最大高度: | 2.64 mm | 子类别: | Audio Synthesizer ICs |
最大压摆率: | 30 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.52 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ISD2560SI | ETC | Solid-State Recorder |
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ISD2560SY | WINBOND | Speech Synthesizer With RCDG, 60s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 |
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ISD2560T | WINBOND | Consumer IC |
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ISD2560TI | WINBOND | Consumer IC |
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ISD2560X | WINBOND | Speech Synthesizer With RCDG, 60s, CMOS, DIE-28 |
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ISD2564 | WINBOND | SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND |
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