Datasheet > ISD2560PI

ISD2560PI

更新时间： 2024-02-12 02:22:30

品牌	Logo	应用领域
华邦 - WINBOND		可编程只读存储器电动程控只读存储器电可擦编程只读存储器按钮和信息提示光电二极管商用集成电路
页数	文件大小	规格书
42页	372K
描述
Consumer IC

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中文翻译

获取价格

技术参数
数据手册

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ISD2560PI 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.83
Is Samacsys：	N	Base Number Matches：	1

ISD2560PI 数据手册

ISD2560/75/90/120

ISD2560/75/90/120 PRODUCT PAD DESIGNATIONS

(with respect to die center)

Pad

Pad Name

Address 0

Address 1

Address 2

Address 3

Address 4

Address 5

Address 6

Address 7

X Axis (µm)

-897.9

Y Axis (µm)

3135.2

2888.9

2671.0

2441.5

-2583.2

-2768.4

-3050.8

-3115.7

-3096.5

-3138.9

-3068.4

-3110.8

-3146.0

-3130.3

-2654.0

-2411.0

2489.5

-1115.4

-1331.0

-1544.0

-1640.4

-1698.2

-1731.2

-1410.2

-1112.4

-408.2

-46.65

386.1

746.9

1101.2

1294.7

1666.4

1728.6

1700.9

1674.6

Address 8

Address 9

AUX IN

V_SSD

V_SSA

SP+

SP-

V_CCA

MIC

MIC REF

AGC

ANA IN

ANA OUT

Auxiliary Input

V_SSDigital Power Supply

V_SSAnalog Power Supply

Speaker Output +

Speaker Output -

V_CCAnalog Power Supply

Microphone Input

Microphone Reference

Automatic Gain Control

Analog Input

Analog Output

Overflow Output

OVF

Chip Enable Input

1726.7

2824.4

Power Down Input

End of Message

1730.5

1341.2

3094.0

3122.1

EOM

XCLK

No Connect (optional)

Playback/Record

986.5

807.2

3160.7

3163.4

P/R

V_CCD

V_CCDigital Power Supply

544.4

3159.6

Publication Release Date: May 2003

Revision 1.0

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中文翻译

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