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ISD17150XY PDF预览

ISD17150XY

更新时间: 2024-01-31 11:40:05
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

ISD17150XY 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknown风险等级:5.7
Is Samacsys:NBase Number Matches:1

ISD17150XY 数据手册

 浏览型号ISD17150XY的Datasheet PDF文件第18页浏览型号ISD17150XY的Datasheet PDF文件第19页浏览型号ISD17150XY的Datasheet PDF文件第20页浏览型号ISD17150XY的Datasheet PDF文件第22页浏览型号ISD17150XY的Datasheet PDF文件第23页浏览型号ISD17150XY的Datasheet PDF文件第24页 
ISD1700 SERIES  
11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)  
Plastic Dual Inline Package (PDIP) (P) Dimensions  
INCHES  
MILLIMETERS  
Min  
1.445  
Nom  
1.450  
0.150  
0.070  
Max  
1.455  
Min  
36.70  
Nom  
36.83  
3.81  
Max  
36.96  
A
B1  
B2  
C1  
C2  
D
0.065  
0.600  
0.530  
0.075  
0.625  
0.550  
0.19  
1.65  
15.24  
13.46  
1.78  
1.91  
15.88  
13.97  
4.83  
0.540  
13.72  
D1  
E
F
G
H
J
S
0
0.015  
0.125  
0.015  
0.055  
0.38  
3.18  
0.38  
1.40  
0.135  
0.022  
0.065  
3.43  
0.56  
1.65  
0.018  
0.060  
0.100  
0.010  
0.075  
0.46  
1.52  
2.54  
0.25  
1.91  
0.008  
0.070  
0°  
0.012  
0.080  
15°  
0.20  
1.78  
0°  
0.30  
2.03  
15°  
11.4 DIE INFORMATION  
For die info, please contact the local Winbond Sales Representatives.  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  
- 21 -  

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